TG250 PCB Manufacturers

Our mission is to become an innovative supplier of high-tech digital and communication devices by providing value added design, world-class manufacturing, and service capabilities for TG250 PCB,SH260 PCB,High heat resistant PCB,S2600F PCB,CIT600 PCB, We hope to establish far more organization associations with consumers all over the globe.
TG250 PCB, Our staffs are adhering to the "Integrity-based and Interactive Development" spirit, and the tenet of "First-class Quality with Excellent Service". According to the needs of every customer, we provide customized & personalized services to help customers achieve their goals successfully. Welcome clients from home and abroad to call and inquire!

Hot Products

  • Buried resistor PCB

    Buried resistor PCB

    Buried resistor PCB--The backplane has always been a specialized product in the PCB manufacturing industry. The backplane is thicker and heavier than conventional PCB boards, and accordingly its heat capacity is also larger.The following is about Double sided Pressfit Backdrill Board related, I hope to help you better understand Double sided Pressfit Backdrill Board.
  • EP3C25F324C8N

    EP3C25F324C8N

    ​EP3C25F324C8N is an FPGA (Field Programmable Gate Array) belonging to the Cyclone III series, designed and produced by Intel/Altera. This FPGA has the following features and specifications:
  • BCM43694B1KRFBG

    BCM43694B1KRFBG

    BCM43694B1KRFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC2C384-7TQG144C

    XC2C384-7TQG144C

    XC2C384-7TQG144C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC3S1000-4FGG456I

    XC3S1000-4FGG456I

    XC3S1000-4FGG456I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU095-1FFVB2104I

    XCVU095-1FFVB2104I

    ​XCVU095-1FFVB2104I is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, belonging to the Kintex UltraScale series. This chip adopts advanced 20nm process technology, providing maximum performance and integration, especially suitable for applications in high-performance computing, network communication, data centers, and AI fields. Here are some detailed introductions about XCVU095-1FFVB2104I

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