Controlled Deep Blind Hole PCB Manufacturers

Our enterprise insists all along the standard policy of "product good quality is base of organization survival; client gratification could be the staring point and ending of an enterprise; persistent improvement is eternal pursuit of staff" and the consistent purpose of "reputation to start with, purchaser first" for Controlled Deep Blind Hole PCB,Cross Blind Buried Hole PCB,4-layer RO4003C PCB, Our items are regularly supplied to lots of Groups and lots of Factories. Meanwhile, our products are sold to the USA, Italy, Singapore, Malaysia, Russia, Poland, plus the Middle East.
Controlled Deep Blind Hole PCB, As an experienced manufacturer we also accept customized order and we could make it the same as your picture or sample specification. The main goal of our company is to live a satisfactory memory to all the customers, and establish a long term business relationship with buyers and users all over the world.

Hot Products

  • BCM56500B2IEBG

    BCM56500B2IEBG

    BCM56500B2IEBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU29P-2FSGA2577E

    XCVU29P-2FSGA2577E

    XCVU29P-2FSGA2577E is an FPGA chip from Xilinx, with the following features and specifications: Brand and Manufacturer: Xilinx is the manufacturer of this chip, renowned in the industry for its high quality and reliability. ‌
  • XC7V585T-1FF1761I

    XC7V585T-1FF1761I

    XC7V585T-1FF1761I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC9572XL-10VQG44C

    XC9572XL-10VQG44C

    XC9572XL-10VQG44C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU040-2FBVA676E

    XCKU040-2FBVA676E

    ​XCKU040-2FBVA676E is a Kintex based ® The UltraScale architecture FPGA (Field Programmable Gate Array) chip is produced by AMD (formerly Xilinx). It has high performance and flexible programmability, suitable for a wide range of application fields such as data centers
  • XCZU2CG-2SFVC784I

    XCZU2CG-2SFVC784I

    XCZU2CG-2SFVC784I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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