4-layer RO4003C PCB Manufacturers

Our goal is to satisfy our customers by offering golden service, good price and high quality for 4-layer RO4003C PCB,Cross Blind Buried Hole PCB,Controlled Deep Blind Hole PCB, Our products are strictly inspected before exporting , So we gain a good reputation all over the world. We looking forward to cooperation with you in the future.
4-layer RO4003C PCB, In the increasingly competitive market, With sincere service high quality merchandise and well-deserved reputation, we always supply customers support on items and techniques to achieve long-term cooperation. Living by quality, development by credit is our eternal pursuit, We firmly believe that after your visit we'll become long-term partners.

Hot Products

  • XCKU035-1FBVA676I

    XCKU035-1FBVA676I

    XCKU035-1FBVA676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM54616C0KFBG

    BCM54616C0KFBG

    BCM54616C0KFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU13P-2FHGB2104E

    XCVU13P-2FHGB2104E

    XCVU13P-2FHGB2104E is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 1.3 million logic cells, 50 Mb of block RAM, and 624 Digital Signal Processing (DSP) slices, making it ideal for high-performance applications such as high-performance computing, machine vision, and video processing. It operates on a 0.85V to 0.9V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 1 GHz. The device comes in a flip-chip BGA (FHGB2104E) package with 2104 pins, providing high pin-count connectivity for a variety of applications. XCVU13P-2FHGB2104E is commonly used in advanced systems such as wireless communications, cloud computing, and high-speed networking. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it a top choice for mission-critical applications where reliability and performance are critical.
  • HI-1573PST

    HI-1573PST

    HI-1573PST ​Features:Dual Channel Transceiver: The HI-1573PST is a dual transceiver that provides separate transmit and receive HI-1573PST channels for MIL-STD-1553 data bus communication.MIL-STD-1553 Compliant: Compliant with MIL-STD-1553A and B, as well as ARINC 708A standards, ensuring compatibility with military and aerospace systems.3.3V
  • XCVU27P-2FSGA2577E

    XCVU27P-2FSGA2577E

    ​XCVU27P-2FSGA2577E is an FPGA chip produced by Xilinx, belonging to the Virtex UltraScale series. This chip has the characteristics of high performance and low power consumption, and is suitable for various application scenarios, such as data centers, communications, industrial control,
  • MT53E512M32D1ZW-046WT:B

    MT53E512M32D1ZW-046WT:B

    MT53E512M32D1ZW-046WT:B is most likely a type of memory chip or module. However, without further context or information about the product, I'm unable to provide a detailed English description of it. Please provide more context or details about the product so that I can give you a more accurate answer.

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