3F2R Rigid Flex PCB Manufacturers

Excellent comes 1st; service is foremost; small business is cooperation" is our organization philosophy which is regularly observed and pursued by our company for 3F2R Rigid Flex PCB,8-layer Rigid-Flex PCB,6-layer flexible FPC,10-layer flexible FPC,8-layer flexible FPC, We price your inquiry, For more facts, please get in touch with us, we will reply you ASAP!
3F2R Rigid Flex PCB, Meanwhile, we're building up and consummating triangle market & strategic cooperation in order to achieve a multi-win trade supply chain to expand our market vertically and horizontally for a brighter prospects. development. Our philosophy is to create cost-effective products and solutions, promote perfect services, cooperate for long-term and mutual benefits, firm a comprehensive mode of excellent suppliers system and marketing agents, brand strategic cooperation sales system.

Hot Products

  • XC7VX1140T-2FLG1926E

    XC7VX1140T-2FLG1926E

    XC7VX1140T-2FLG1926E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10AX115N3F40I2SG

    10AX115N3F40I2SG

    10AX115N3F40I2SG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7Z045-2FFG676E

    XC7Z045-2FFG676E

    ​XC7Z045-2FFG676E is a high-performance FPGA chip launched by Xilinx, which has the characteristics of high-speed processing capability, low power consumption, and high integration, and is suitable for various applications in modern communication systems. This chip is based on the ARM Cortex-A9 core
  • XCVU33P-2FSVH2104I

    XCVU33P-2FSVH2104I

    XCVU33P-2FSVH2104I is a powerful field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 2.5 million logic cells, 45 Mb of block RAM, and 3,600 Digital Signal Processing (DSP) slices, making it suitable for high-performance applications in various industries. It operates on a 0.85V to 0.9V power supply and supports various I/O standards such as LVCMOS,
  • 8OZ Heavy copper PCB

    8OZ Heavy copper PCB

    In PCB proofing, a layer of copper foil is bonded to the outer layer of FR-4. When the copper thickness is = 8oz, it is defined as a 8OZ heavy copper pcb. The 8OZ heavy copper pcb has excellent extension performance, high temperature, low temperature, and corrosion resistance, which allows electronic equipment products to have a longer service life, and also greatly helps the size of electronic equipment to be simplified. In particular, electronic products that need to run higher voltages and currents require 8OZ heavy copper pcb.
  • HI-8598PSTF

    HI-8598PSTF

    ​HI-8598PSTF is an electronic component, but according to the provided search results, specific detailed information about HI-8598PSTF is relatively limited. However, I can infer some possible information based on similar product features and applications in the search results:

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