6-layer flexible FPC Manufacturers

The key to our success is "Good Products Good quality, Reasonable Price and Efficient Service" for 6-layer flexible FPC,8-layer Rigid-Flex PCB,10-layer flexible FPC,8-layer flexible FPC,4-layer flexible FPC, In order to expand our international market, we mainly supply our oversea customers Top quality performance products and service.
6-layer flexible FPC, With the aim of "compete with good quality and develop with creativity" and the service principle of "take customers' demand as orientation", we are going to earnestly supply qualified solutions and good service for domestic and international customers.

Hot Products

  • 10M02SCU169C8G

    10M02SCU169C8G

    ​10M02SCU169C8G is a MAX 10 series FPGA chip produced by Intel (formerly Altera). This chip has non-volatile characteristics, built-in dual configuration flash memory and user flash memory, and supports instant configuration. It integrates an analog-to-digital converter (ADC) and a single-chip Nios II soft core processor, suitable for various applications such as system management, I/O expansion, and storage
  • 40-layer M6G high speed PCB

    40-layer M6G high speed PCB

    When the 40-layer M6G high speed PCB is close to the parallel high-speed differential signal line pair, in the case of impedance matching, the coupling of the two lines will bring many advantages. However, it is believed that this will increase the attenuation of the signal and affect the transmission distance.
  • XCVU440-2FLGA2892I

    XCVU440-2FLGA2892I

    XCVU440-2FLGA2892I Shenzhen Hongtai Express Electronics Co., Ltd. is an electronic trading company specializing in imported brand electronic components, with rich experience in the electronics industry。Strength merchants, quality assurance, new original, complete models, a station to buy all
  • XC7K355T-1FFG901I

    XC7K355T-1FFG901I

    XC7K355T-1FFG901I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU3P-2FFVB676E

    XCKU3P-2FFVB676E

    ​XCKU3P-2FFVB676E is a high-performance FPGA (Field Programmable Gate Array) chip launched by Xilinx. This chip belongs to the UltraScale architecture and has excellent cost-effectiveness, performance, and power consumption performance, making it particularly suitable for applications such as packet processing,
  • XC3S1200E-4FGG400C

    XC3S1200E-4FGG400C

    XC3S1200E-4FGG400C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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