XCVU7P-3FLVC2104E

XCVU7P-3FLVC2104E also supports humidity sensitivity and adapts to different working environment requirements. The packaging form of this chip is BGA, which provides powerful logic processing capability and high-speed data transmission rate, suitable for application scenarios that require high-performance computing and signal processing. For example, in the fields of data centers, network communication, video encoding and decoding, XCVU7P-3FLVC2104E can provide powerful computing and acceleration functions, meet the requirements of high-speed data processing and forwarding capabilities, as well as efficient image and signal processing capabilities