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10-layer flexible FPC Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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  • 2.5G optical module PCB

    2.5G optical module PCB

    2.5G optical module PCB--The function of the optical module is photoelectric conversion. The transmitting end converts the electrical signal into an optical signal. After transmission through the optical fiber, the receiving end converts the optical signal into an electrical signal.The following is about 2.5G Optical Module PCB related, I hope to help you better understand 2.5G Optical Module PCB.
  • 5SGXMA3H3F35C4G

    5SGXMA3H3F35C4G

    ​5SGXMA3H3F35C4G is an FPGA (Field Programmable Gate Array) produced by Intel (formerly Altera). This FPGA has the following features and specifications:
  • BCM56649KB0KFSBLG

    BCM56649KB0KFSBLG

    BCM56649KB0KFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S1400AN-4FGG676I

    XC3S1400AN-4FGG676I

    XC3S1400AN-4FGG676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • R-F775 PCB

    R-F775 PCB

    In the PCB proofing of electronic consumer, the use of R-F775 PCB not only maximizes the space use and minimizes the weight, but also greatly improves the reliability, thus eliminating many requirements for welded joints and fragile wiring prone to connection problems. The rigid Flex PCB also has high impact resistance and can survive in high stress environment.
  • EP2AGX190FF35I3G

    EP2AGX190FF35I3G

    EP2AGX190FF35I3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
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  • Non-Apple HDI Big Release

    According to market reports, Huawei and other non-Apple flagship HDI expanded release orders, which will add momentum to the PCB factory's off-season operations in the first quarter of this year.

  • PCBs are divided into three categories according to the number of layers

    Classification according to the number of circuit layers: Divided into single panel, double panel and multilayer board.

  • Foxconn changes cage to Phoenix and wants to regain market with 8K

    Guo Taiming described its acquisition of Sharp and the introduction of 8K display technology as a replacement for the phoenix. Whether this phoenix can bring Guo Taiming the expected growth and prompt Foxconn to regain the market is still to be verified.

  • HDI board application

    HDI is widely used in mobile phones, digital (camera) cameras, MP3, MP4, notebook computers, automotive electronics and other digital products, among which mobile phones are the most widely used. HDI boards are generally manufactured by the build-up method.

  • PCB production, you must pay attention to these matters

    Cutting, fillet, edging, baking, inner layer pretreatment, coating, exposure, DES (development, etching, film removal), punching, AOI inspection, VRS repair, browning, lamination, pressing, target drilling, Gong edge, drilling, copper plating, film pressing, printing, writing, surface treatment, final inspection, packaging and other processes are countless

  • The origin of 50 ohms in impedance matching

    For traces with a certain width, three main factors will affect the impedance of PCB traces. First of all, the EMI (electromagnetic interference) of the near field of the PCB trace is proportional to the height of the trace from the reference plane. The lower the height, the smaller the radiation. Secondly, the crosstalk will change significantly with the height of the trace. If the height is reduced by half, the crosstalk will be reduced to nearly a quarter.

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