10-layer flexible FPC Manufacturers

We try for excellence, service the customers", hopes to be the most effective cooperation workforce and dominator company for staff, suppliers and shoppers, realizes price share and ongoing marketing for 10-layer flexible FPC,8-layer Rigid-Flex PCB,6-layer flexible FPC,8-layer flexible FPC,4-layer flexible FPC, Welcome any within your inquiries and concerns for our products and solutions, we glance ahead to setting up a long-term enterprise partnership along with you within the close to potential. get hold of us today.
10-layer flexible FPC, Our factory insists on the principle of "Quality First, Sustainable Development", and takes "Honest Business, Mutual Benefits" as our developable goal. All members sincerely thanks for all old and new customers' support. We are going to keep working hard and offering you the highest-quality products and solutions and service.Thanks.

Hot Products

  • XC5VFX70T-1FFG1136C

    XC5VFX70T-1FFG1136C

    ​XC5VFX70T-1FFG1136C is a Virtex-5 series FPGA chip produced by Xilinx. The chip is packaged in BGA and has 640 input/output ports, making it a programmable logic device. Its main features include high performance, rich logical units and I/O resources, suitable for various complex application scenarios.
  • Robot 3step HDI PCB

    Robot 3step HDI PCB

    The heat resistance of the Robot 3step HDI PCB is an important item in the reliability of HDI. The thickness of the Robot 3step HDI Circuit Board becomes thinner and thinner, and the requirements for its heat resistance are getting higher and higher. The advancement of the lead-free process has also increased the requirements for the heat resistance of HDI boards. Since the HDI board is different from the ordinary multilayer through-hole PCB board in terms of layer structure, the heat resistance of the HDI board is the same as that of ordinary multilayer through-hole PCB board is different.
  • Ro3003 High Frequency PCB

    Ro3003 High Frequency PCB

    With the rapid development of information technology, the trend of high-frequency and high-speed information processing is becoming more and more obvious. The demand for PCBs that can be used at low and high frequencies is increasing. For PCB manufacturers, timely and accurate grasp of market needs and The development trend will make the enterprise invincible. And the finished board has good dimensional stability. The following is about Ro3003 High Frequency PCB related, I hope to help you better understand Ro3003 High Frequency PCB.
  • PM-DB2745L+

    PM-DB2745L+

    ​The introduction of PM-DB2745L+may vary depending on specific product specifications, manufacturers, and application scenarios. However, based on the search results I found, I can provide some general information about PM-DB2745L (note that information about PM-DB2745L+was not directly found, but usually the "+" in the model may indicate some variant or upgraded version):
  • XC7K70T-1FBG484C

    XC7K70T-1FBG484C

    XC7K70T-1FBG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7Z020-1CLG400I

    XC7Z020-1CLG400I

    ​The XC7Z020-1CLG400I embedded system on chip (SoC) adopts a dual core ARM Cortex-A9 processor configuration, integrating 7 series programmable logic (up to 6.6M logic units and 12.5Gb/s transceiver), providing highly differentiated design for various embedded applications.

Send Inquiry