Products
Home > Products > Thermoelectric separation of copper based PCB

Thermoelectric separation of copper based PCB Manufacturers

We are commitment to offer the competitive price ,outstanding products quality, as well as fast delivery for Thermoelectric separation of copper based PCB,Double-sided copper based PCB,Ceramic PCB, We have been prepared to offer you the top suggestions on the designs of one's orders in a professional way if you need. During the meantime, we retain on developing new technologies and building new designs so as for making you ahead within the line of this business.
Thermoelectric separation of copper based PCB, We take measure at any price to attain essentially the most up-to-date gear and procedures. The packing of nominated brand is our a further distinguishing feature. The solutions to assure years of trouble-free service has attracted a great deal customers. The items are obtainable in improved designs and richer variety, they're produced scientifically of purely raw sup+C7plies. It accessible in a variety of designs and specs for the selection. The newest forms are much far better than the previous one and they're extremely popular with several clients.

Related Products

Hot Products

  • XCVU47P-2FSVH2892E

    XCVU47P-2FSVH2892E

    XCVU47P-2FSVH2892E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • MT41K512M16HA-125 AIT:A

    MT41K512M16HA-125 AIT:A

    MT41K512M16HA-125 AIT:A is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10M08SAU169I7G

    10M08SAU169I7G

    10M08SAU169I7G is an FPGA (Field Programmable Gate Array) product produced by Intel (formerly Altera). Here are some detailed information about 10M08SAU169I7G
  • XCVU13P-3FIGD2104E

    XCVU13P-3FIGD2104E

    ​XCVU13P-3FIGD2104E is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, with the following features and specifications: Number of logic elements: There are 3780000 logic elements (LE). Adaptive Logic Module (ALM): Provides 216000 ALMs. Embedded memory: Built in 94.5 Mbit of embedded memory. Number of input/output terminals: Equipped with 752 I/O terminals.
  • Ladder PCB

    Ladder PCB

    Ladder PCB technology can reduce the thickness of PCB locally, so that the assembled devices can be embedded in the thinning area, and realize the bottom welding of ladder, so as to achieve the purpose of overall thinning.
  • XC5VLX110-1FFG1153C

    XC5VLX110-1FFG1153C

    ​The XC5VLX110-1FFG1153C features 110,592 logic elements (LUTs) and 800 input/output (I/O) ports, providing high flexibility and scalability for complex digital designs.
  • Related Blog
  • Reviews

  • Semiconductor refrigeration technology

    Semiconductor refrigeration technology is widely used in the current refrigeration technology. During the growth of crops in the greenhouse, semiconductor refrigeration technology can effectively control the environmental temperature, especially for some plants with high requirements for the environment

  • What Are Multilayer Boards?

    Multi-layer PCB is a circuit board composed of more than two layers of electrical layer (copper foil layer) superimposed on each other. The copper layers are bonded together by layers of resin.

  • What is the future development prospect of chips in China

    Chips are also known as integrated circuits and microcircuits. Mobile phone chips are an important branch of them. All functions of smart phones currently used by everyone depend on mobile phone chips. Mobile phones without chips are even worse than bricks. It can be seen that mobile phones rely heavily on chips. Chip technology directly affects the future development of mobile communications.

  • Analysis of the Current Development Status and Prospects of Semiconductor Application Industry in China

    In the 1980s, China began to enter the semiconductor industry. In the early days, semiconductor technology mainly relied on imports, while China mainly engaged in simple assembly and testing work. At that time, major enterprises such as Shanghai Hongli and East China Semiconductor had a significant gap between their product technology level and the international advanced level, but it laid the foundation for the Chinese semiconductor industry

  • What are the benefits of semiconductors

    IC refers to integrated circuits, which are made on semiconductors because semiconductors are the most suitable materials for realizing transistors, and transistors are the core devices of most circuits now. However, I want to write more here, tracing back to the origin, starting from the beginning of "circuit"

  • What are the electronic components and what are the functions of each component

    Commonly used electronic components are: resistance, capacitance, inductance, potentiometer, transformer, diode, triode, MOS tube, integrated circuit, etc.

Send Inquiry