3MM thick coil PCB Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • HI-8282APJI

    HI-8282APJI

    HI-8282APJI is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • R-F775 Rigid-Flex PCB

    R-F775 Rigid-Flex PCB

    10-layer R-F775 Rigid-Flex PCB is a new type of printed circuit board that combines the durability of a rigid PCB and the adaptability of a flexible PCB.medical and military equipment, companies in the mainland are also gradually increasing the proportion of rigid-flex boards in total output.
  • 5CEBA2F23C8N

    5CEBA2F23C8N

    ​The design of 5CEBA2F23C8N can simultaneously meet the decreasing power consumption, cost, and time to market requirements, as well as the increasing bandwidth demands of high-capacity and cost sensitive applications. Due to the integration of transceivers and hard memory controllers
  • XCF128XFTG64C

    XCF128XFTG64C

    XCF128XFTG64C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7A75T-2FGG676C

    XC7A75T-2FGG676C

    ​XC7A75T-2FGG676C is an FPGA (Field Programmable Gate Array) chip produced by Xilinx. This chip belongs to the Xilinx 7 series FPGA, designed to meet all system requirements from low-cost, small size, cost sensitive, large-scale applications to ultra high end connection bandwidth, logic capacity, and signal processing. The XC7A75T-2FGG676C chip has the following characteristics and specifications
  • XC7A100T-2FGG676C

    XC7A100T-2FGG676C

    XC7A100T-2FGG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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