Meg4 PCB Manufacturers

Assume full obligation to meet all demands of our customers; accomplish ongoing advancements by promoting the advancement of our customers; become the final permanent cooperative partner of clientele and maximize the interests of shoppers for Meg4 PCB,Megtron4 PCB,Panasonic M4 PCB,Backdrill PCB,Nickel palladium PCB, Let's cooperate hand in hand to jointly make a beautiful future. We sincerely welcome you to visit our company or contact us for cooperation!
Meg4 PCB, For many years, we now have adhered to the principle of customer oriented, quality based, excellence pursuing, mutual benefit sharing. We hope, with great sincerity and good will, to have the honor to help with your further market.

Hot Products

  • XC3S400AN-4FGG400I

    XC3S400AN-4FGG400I

    XC3S400AN-4FGG400I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • N7000-1 PCB

    N7000-1 PCB

    N7000-1 PCB is a kind of high temperature resistant polyimide PCB produced by nelco in Singapore. Its main application field is aviation and maritime communication industry. It has high temperature resistance, low temperature resistance, good water absorption and strong stability. It is a high frequency material with BT property and easy to process
  • EP3SE110F1152I3N

    EP3SE110F1152I3N

    EP3SE110F1152I3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 10 Layer 4Step HDI PCB

    10 Layer 4Step HDI PCB

    HDI is the English abbreviation of High Density Interconnector, high-density interconnect (HDI) manufacturing printed circuit board. The printed circuit board is a structural element formed by insulating material supplemented by conductor wiring. The following is about 10 Layer 4Step HDI PCB related, I hope to help you better understand 10 Layer 4Step HDI PCB.
  • BCM54980C1KFB

    BCM54980C1KFB

    BCM54980C1KFB is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7Z010-3CLG225E

    XC7Z010-3CLG225E

    XC7Z010-3CLG225E is an FPGA (Field Programmable Gate Array) chip based on ARM Cortex-A9 processor launched by Xilinx. This chip integrates SoC (System on a Chip) architecture, which has the characteristics of high performance and high flexibility

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