Gold finger PCB Manufacturers

Our growth depends to the superior products ,great talents and repeatedly strengthened technology forces for Gold finger PCB,Hard gold PCB,20-layer PCB,Impedance control PCB, We have been not pleased while using the present achievements but we're trying finest to innovate to satisfy buyer's more personalized needs. No matter where you are from, we're here to wait for your type request, and welcom to visit our manufacturing unit. Choose us, you can satisfy your dependable supplier.
Gold finger PCB, Our expert engineering team will generally be prepared to serve you for consultation and feedback. We're able to also give you with free of charge samples to meet your requirements. Best efforts will likely be produced to provide you the best service and merchandise. When you are keen on our business and items, make sure you speak to us by sending us emails or call us quickly. In an effort to know our merchandise and company extra, you may come to our factory to view it. We'll generally welcome guests from all over the world to our business to create business relations with us. Be sure to feel cost-free to speak to us for small business and we believe we are going to share the best trading experience with all our merchants.

Hot Products

  • XC7K70T-2FBG676C

    XC7K70T-2FBG676C

    XC7K70T-2FBG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU3P-2FFVC1517I

    XCVU3P-2FFVC1517I

    XCVU3P-2FFVC1517I is a high-performance FPGA based on 14nm/16nm FinFET nodes, supporting 3D IC technology and various computationally intensive applications.
  • TU-943N High-speed PCB

    TU-943N High-speed PCB

    TU-943N High-speed PCB -- the development of electronic technology is changing with each passing day. This change mainly comes from the progress of chip technology. With the wide application of deep submicron technology, semiconductor technology is becoming increasingly physical limit. VLSI has become the mainstream of chip design and application.
  • EP2SGX30DF780C5N

    EP2SGX30DF780C5N

    EP2SGX30DF780C5N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 8-layer gold finger PCB

    8-layer gold finger PCB

    The 8-layer gold finger PCB is actually coated with a layer of gold on the copper clad laminate by a special process, because the gold has strong oxidation resistance and strong conductivity.
  • XCZU67DR-2FFVE1156I

    XCZU67DR-2FFVE1156I

    XCZU67DR-2FFVE1156I is one of the Zynq UltraScale+RFSoC series products produced by AMD/Xilinx

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