5OZ Heavy copper PCB Manufacturers

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Hot Products

  • EP1C12F324C8N

    EP1C12F324C8N

    EP1C12F324C8N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Buried Copper Coin PCB

    Buried Copper Coin PCB

    The so-called Buried Copper Coin PCB is a PCB board in which a copper Coin is partially embedded on the PCB. The heating elements are directly attached to the surface of the copper Coin board, and the heat is transferred out through the copper Coin.
  • 5SGXMA4H3F35C4G

    5SGXMA4H3F35C4G

    ​5SGXMA4H3F35C4G is an FPGA field programmable gate array belonging to the Altera brand, with a packaging type of FBGA-1152. This product has the following characteristics and specifications:
  • XCVU35P-3FSVH2104E

    XCVU35P-3FSVH2104E

    XCVU35P-3FSVH2104E is an electronic component, specifically an FPGA (Field Programmable Gate Array) chip produced by Xilinx. The following is a detailed introduction about XCVU35P-3FSVH2104E
  • XC3S200AN-4FTG256C

    XC3S200AN-4FTG256C

    XC3S200AN-4FTG256C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7K160T-1FFG676C

    XC7K160T-1FFG676C

    XC7K160T-1FFG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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