4mm thick PCB Manufacturers

Our pursuit and enterprise aim would be to "Always fulfill our buyer requirements". We carry on to acquire and layout excellent quality items for the two our old and new clients and realize a win-win prospect for our shoppers in addition as us for 4mm thick PCB,Super thick PCB,8mm thick PCB,7mm thick PCB,10mm thick PCB, Prospects first! Whatever you require, we should do our utmost to help you. We warmly welcome clients from all around the globe to cooperate with us for mutual enhancement.
4mm thick PCB, We've got constantly insisted on the evolution of solutions, spent good funds and human resource in technological upgrading, and facilitate production improvement, meeting the wants of prospects from all countries and regions.

Hot Products

  • 5AGXBA3D4F31C5G

    5AGXBA3D4F31C5G

    ​The 5AGXBA3D4F31C5G device series includes the most comprehensive mid-range FPGA products, ranging from the lowest power consumption for 6 Gigabit per second (Gbps) and 10Gbps applications to the highest mid-range FPGA bandwidth of 12.5 Gbps transceivers.
  • HI-6138PQIF

    HI-6138PQIF

    HI-6138PQIF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10CX105YF672E6G

    10CX105YF672E6G

    10CX105YF672E6G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 10AX115H3F34I2SG

    10AX115H3F34I2SG

    ​10AX115H3F34I2SG adopts a 20 nanometer process, which can provide high performance, supporting chip to chip data transmission rates of up to 17.4 Gbps, backplane data transmission rates of up to 12.5 Gbps, and up to 1.15 million equivalent logic units.
  • EP3C80F780I7N

    EP3C80F780I7N

    EP3C80F780I7N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC6SLX75T-3FGG484C

    XC6SLX75T-3FGG484C

    XC6SLX75T-3FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.XC6SLX75T-3FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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