14-layer lcross-blind buried via PCB Manufacturers

To frequently enhance the management process by virtue of your rule of "sincerely, good religion and good quality are the base of company development", we greatly absorb the essence of associated solutions internationally, and regularly produce new goods to meet the needs of shoppers for 14-layer lcross-blind buried via PCB,16-layer large size PCB,18-layer 5step HDI circuit board,EM-890K PCB,EM-891K PCB, Sincerely hope to build long term business relationships with you and we will do our best service for you.
14-layer lcross-blind buried via PCB, All the imported machines effectively control and guarantee the machining precision for the products. Besides, we have a group of high-quality management personnels and professionals, who make the high-quality products and have the ability to develop new products to expand our market home and abroad. We sincerely expect customers come for a blooming business for both of us.

Hot Products

  • 10CL120YF484I7G

    10CL120YF484I7G

    10CL120YF484I7G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications. 10CL120YF484I7G is commonly used in applications such as industrial automation, gaming, and low-power embedded systems. The device is known for its low power consumption, low cost, and high processing capacity, making it an excellent choice for applications where cost and power consumption are critical factors.
  • LTM4637IY#PBF

    LTM4637IY#PBF

    Analog Devices LTM4637IY#PBF BGA133 DC/DC power module switching regulator chip DC converter brand new original
  • 5M160ZE64C4N

    5M160ZE64C4N

    5M160ZE64C4N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • HI-6131PQIF

    HI-6131PQIF

    ​HI-6131PQIF is an integrated circuit product launched by Holt Corporation, specifically designed for the MIL-STD-1553B protocol. This chip provides a complete single or multi-functional interface, connecting the main processor and MIL-STD-1553B bus. HI-6131PQIF has the following features and functions:
  • XC6SLX9-2CPG196C

    XC6SLX9-2CPG196C

    XC6SLX9-2CPG196C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • ST115G PCB

    ST115G PCB

    ST115G PCB -- with the development of integrated technology and microelectronic packaging technology, the total power density of electronic components is growing, while the physical size of electronic components and electronic equipment is gradually tending to be small and miniaturized, resulting in rapid accumulation of heat, resulting in the increase of heat flux around the integrated devices. Therefore, high temperature environment will affect the electronic components and devices This requires a more efficient thermal control scheme. Therefore, the heat dissipation of electronic components has become a major focus in the current electronic components and electronic equipment manufacturing.

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