EM-890K PCB Manufacturers

We emphasize advancement and introduce new products and solutions into the market each year for EM-890K PCB,16-layer large size PCB,18-layer 5step HDI circuit board,14-layer lcross-blind buried via PCB,EM-891K PCB, The main purpose of our company is always to live a satisfactory memory to many of the customers, and establish a lengthy time period enterprise romantic relationship with prospective buyers and users all over the environment.
EM-890K PCB, With many years good service and development, we've a professional international trade sales team. Our products have exported to North America, Europe, Japan, Korea, Australia, New Zealand, Russia and other countries. Looking forward to build up a good and long term cooperation with you in coming future!

Hot Products

  • RO4350B high frequency PCB

    RO4350B high frequency PCB

    With the advent of the 5G era, the high-speed and high-frequency characteristics of information transmission in electronic equipment systems have caused printed circuit boards to face higher integration and greater data transmission tests, which gave birth to high-frequency and high-speed printed circuit boards.The following is about RO4350B high frequency PCB related, I hope to help you better understand RO4350B high frequency PCB.
  • 5CGTFD9D5F27I7N

    5CGTFD9D5F27I7N

    5CGTFD9D5F27I7N is a type of FPGA (Field Programmable Gate Array) made by Intel (formerly Altera). This specific FPGA has 9,360 Logic Elements, operates at a speed of up to 350 MHz, and features 414 Kbit of embedded memory,
  • BCM81392B0IFSBG

    BCM81392B0IFSBG

    BCM81392B0IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM88270CA1IFSBG

    BCM88270CA1IFSBG

    BCM88270CA1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EPM1270F256C5N

    EPM1270F256C5N

    EPM1270F256C5N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • BCM54994EB0KFSBG

    BCM54994EB0KFSBG

    BCM54994EB0KFSBG is a high-performance chip designed for widespread use in network devices, data centers, the Internet of Things, and other fields

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