30-layer PCB Manufacturers

We will constantly satisfy our respected customers with our good excellent, superior value and superior assistance due to we're additional experienced and far more hard-working and do it in cost-effective way for 30-layer PCB,TU-943N high speed PCB,TU-943R high-speed PCB,TUC high-speed circuit board,20 layer Pentium Motherboard PCB, Welcome globally consumers to speak to us for small business and long-term cooperation. We're going to be your reliable partner and supplier of auto parts and accessories in China.
30-layer PCB, Our continual availability of high grade products in combination with our excellent pre-sale and after-sales service ensures strong competitiveness in an increasingly globalized market. welcome new and old customers from all walks of life to contact us for future business relationships and mutual success!

Hot Products

  • XCKU060-1FFVA1156I

    XCKU060-1FFVA1156I

    XCKU060-1FFVA1156I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • ENEPIG PCB

    ENEPIG PCB

    ENEPIG PCB is the abbreviation of gold plating, palladium plating and nickel plating. ENEPIG PCB coating is the latest technology used in electronic circuit industry and semiconductor industry. The gold coating with thickness of 10 nm and palladium coating with thickness of 50 nm can achieve good conductivity, corrosion resistance and friction resistance.
  • XCZU11EG-2FFVC1760I

    XCZU11EG-2FFVC1760I

    ​XCZU11EG-2FFVC1760I series is based on Xilinx ® UltraScale MPSoC architecture. This series of products integrates feature rich 64 bit quad core or dual core Arm in a single device ® Cortex-A53 and dual core Arm Cortex-R5F basic processing system (PS) and Xilinx programmable logic (PL) UltraScale architecture. In addition, it also includes on-chip memory, multi port external memory interfaces, and rich peripheral connection interfaces.
  • BCM56870A0KFSBG

    BCM56870A0KFSBG

    ​BCM56870A0KFSBG supports up to 32 100GbE ports and can be used to build highly scalable, low-power, feature rich top of rack (ToR), aggregation, and spine switches. Programmable pipelines allow for the addition of new features through on-site upgrades after deployment
  • BCM56500B2IEBG

    BCM56500B2IEBG

    BCM56500B2IEBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM56321B1KFSBLG

    BCM56321B1KFSBLG

    BCM56321B1KFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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