Products
Home > Products > EM-LXE high speed PCB

EM-LXE high speed PCB Manufacturers

It is actually a good way to boost our products and solutions and repair. Our mission should be to produce imaginative products and solutions to clients using a fantastic working experience for EM-LXE high speed PCB,7MM thick EM-888 PCB,N4000-13EPSI high frequency PCB, Aggressive selling price with superior quality and satisfying services make us earned far more consumers.we wish to work along with you and look for common improvement.
EM-LXE high speed PCB, After years' creating and developing, with the advantages of trained qualified talents and rich marketing experience, outstanding achievements were gradually made. We get good reputation from the customers due to our good solutions quality and fine after-sale service. We sincerely wish to create a more prosperous and flourishing future together with all the friends home and abroad!

Related Products

Hot Products

  • EP2AGZ350HF40I4N

    EP2AGZ350HF40I4N

    EP2AGZ350HF40I4N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP2S60F1020C5N

    EP2S60F1020C5N

    EP2S60F1020C5N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • BCM65500B1IFSBG

    BCM65500B1IFSBG

    BCM65500B1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC95144XL-10TQG100C

    XC95144XL-10TQG100C

    XC95144XL-10TQG100C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP2S30F672I4N

    EP2S30F672I4N

    EP2S30F672I4N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCZU48DR-2FSVG1517I

    XCZU48DR-2FSVG1517I

    XCZU48DR-2FSVG1517I is a high-performance SoC FPGA (System on Chip Field Programmable Gate Array) chip produced by Xilinx Corporation
  • Related Blog
  • Reviews

  • The origin of 50 ohms in impedance matching

    For traces with a certain width, three main factors will affect the impedance of PCB traces. First of all, the EMI (electromagnetic interference) of the near field of the PCB trace is proportional to the height of the trace from the reference plane. The lower the height, the smaller the radiation. Secondly, the crosstalk will change significantly with the height of the trace. If the height is reduced by half, the crosstalk will be reduced to nearly a quarter.

  • Do you really know about FPCs

    According to the base material, PCB can be divided into flexible circuit board, rigid circuit board and rigid flexible combination plate, which are used in different equipment according to different purposes.

  • Characteristics of semiconductors

    Semiconductor has the following characteristics: dopability, thermal sensitivity, photosensitivity, negative resistivity temperature, and rectifiability.

  • PCB multilayer board

    PCB multilayer board refers to the multilayer circuit board used in electrical products

  • Definition and cause of pink circle on circuit board PCB

    After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.

  • The Function and Principle of Chips

    The main function of a chip is to complete calculations and processing tasks, and an integrated circuit is to package a circuit onto a small component.

Send Inquiry