EM-LXE high speed PCB Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • Buried resistor PCB

    Buried resistor PCB

    Buried resistor PCB--The backplane has always been a specialized product in the PCB manufacturing industry. The backplane is thicker and heavier than conventional PCB boards, and accordingly its heat capacity is also larger.The following is about Double sided Pressfit Backdrill Board related, I hope to help you better understand Double sided Pressfit Backdrill Board.
  • XC7VX1140T-2FLG1926I

    XC7VX1140T-2FLG1926I

    XC7VX1140T-2FLG1926I is a powerful and high-performance FPGA device. Suitable for various complex hardware design and data processing tasks. It supports multiple communication interfaces and DDR3 memory interfaces, providing convenience for system integration. In addition, OpenCL programming also provides designers with greater flexibility, enabling them to better meet different application requirements.
  • Large size sensor PCB

    Large size sensor PCB

    Large size sensor PCB--The sensor is a device to detect Du, which can sense the measured information, and can transform it into electrical signal or other required information output according to certain rules, so as to meet the requirements of information transmission, processing, storage, display, recording and control. It needs PCB, Large size sensor PCB to meet these requirements
  • EP3C120F780I7N

    EP3C120F780I7N

    EP3C120F780I7N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU11P-3FLGB2104E

    XCVU11P-3FLGB2104E

    ​XCVU11P-3FLGB2104E Virtex™ UltraScale+ ™ FPGA devices provide the highest performance and integrated functionality on 14nm/16nm FinFET nodes.
  • XCVU9P-3FLGB2104E

    XCVU9P-3FLGB2104E

    ​XCVU9P-3FLGB2104E is an FPGA (Field Programmable Gate Array) product produced by Xilinx, belonging to the Virtex UltraScale series. Here are some detailed specifications and features about XCVU9P-3FLGB2104E

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