22-layer 3M C-Ply Buried capacitance PCB Manufacturers

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Hot Products

  • BCM5337MKQMG

    BCM5337MKQMG

    BCM5337MKQMG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU7EV-2FFVF1517I

    XCZU7EV-2FFVF1517I

    XCZU7EV-2FFVF1517I is an SoC (System on Chip) from Xilinx's Zynq UltraScale+ MPSoC (Multi-Processor System on Chip) series. This chip combines advanced processing subsystems with FPGA programmable logic on a single chip, providing a high level of performance and flexibility for developers.
  • XCVU11P-1FLGA2577E

    XCVU11P-1FLGA2577E

    ​XCVU11P-1FLGA2577E is an FPGA (Field Programmable Gate Array) product produced by Xilinx Corporation. This FPGA supports Virtex ® The UltraScale+architecture provides high-performance computing power and flexible configuration options, suitable for various application scenarios that require high performance and low power consumption
  • XC7A75T-2FGG676C

    XC7A75T-2FGG676C

    ​XC7A75T-2FGG676C is an FPGA (Field Programmable Gate Array) chip produced by Xilinx. This chip belongs to the Xilinx 7 series FPGA, designed to meet all system requirements from low-cost, small size, cost sensitive, large-scale applications to ultra high end connection bandwidth, logic capacity, and signal processing. The XC7A75T-2FGG676C chip has the following characteristics and specifications
  • LTC6993HS6-2#TRMPBF

    LTC6993HS6-2#TRMPBF

    LTC6993HS6-2#TRMPBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • AD8622ARZ

    AD8622ARZ

    AD8622ARZ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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