Super large aperture ratio PCB Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • XC6SLX45-2FGG676C

    XC6SLX45-2FGG676C

    XC6SLX45-2FGG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10M50DAF484C8G

    10M50DAF484C8G

    ​The 10M50DAF484C8G device is a single chip, non-volatile low-cost programmable logic device (PLD) used to integrate the best set of system components.
  • XCVU13P-3FIGD2104E

    XCVU13P-3FIGD2104E

    ​XCVU13P-3FIGD2104E is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, with the following features and specifications: Number of logic elements: There are 3780000 logic elements (LE). Adaptive Logic Module (ALM): Provides 216000 ALMs. Embedded memory: Built in 94.5 Mbit of embedded memory. Number of input/output terminals: Equipped with 752 I/O terminals.
  • TU-943R High-speed PCB

    TU-943R High-speed PCB

    TU-943R High-speed PCB - when wiring the multi-layer printed circuit board, as there are not many lines left in the signal line layer, adding more layers will cause waste, increase certain workload and increase the cost. To solve this contradiction, we can consider wiring on the electrical (ground) layer. First of all, the power layer should be considered, followed by the formation. Because it is better to preserve the integrity of the formation.
  • XCKU15P-L2FFVE1760E

    XCKU15P-L2FFVE1760E

    ​XCKU15P-L2FFVE1760E Kinex ® UltraScale+ ™ The device can achieve a balance between required system performance and extremely low power consumption, while supporting packet processing and DSP intensive functions, making it an ideal choice for wireless MIMO technology, Nx100G wired networks, as well as data center networks and storage acceleration applications
  • 18G Radar Antenna PCB

    18G Radar Antenna PCB

    The high frequency of electronic equipment is a development trend, especially in the increasing development of wireless networks and satellite communications, information products are moving toward high speed and high frequency, and communication products are moving toward large capacity and high speed wireless transmission of voice, video and data standardization. The development of new generation products requires high-frequency substrates. The following is about 18G Radar Antenna PCB related, I hope to help you better understand 18G Radar Antenna PCB.

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