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    XC6SLX16-3CSG225I

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    CY15B104Q-LHXI

    CY15B104Q-LHXI is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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    XCZU47DR-L1FFVG1517I

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    LT1763MPDE#PBF

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    Our common computer boards and cards are basically epoxy resin glass cloth based double-sided printed circuit boards. One side is the plug-in components, and the other side is the welding surface of the component feet. It can be seen that the welding points are very regular.

  • What Are Multilayer Boards?

    Multi-layer PCB is a circuit board composed of more than two layers of electrical layer (copper foil layer) superimposed on each other. The copper layers are bonded together by layers of resin.

  • Change of substrate size in PCB manufacturing process

    the difference between longitude and latitude causes the change of substrate size; Due to the failure to pay attention to the fiber direction during shearing, the shear stress remains in the substrate.

  • Future development prospect of semiconductor

    The global semiconductor market is expected to continue to grow with the global scientific and technological progress and the industrial application of 5G technology, artificial intelligence, new energy vehicles and other technologies

  • Development history of electronic components

    The development history of electronic components is actually a condensed history of electronic development. Electronic technology is a new technology developed at the end of the 19th century and the beginning of the 20th century. It has developed most rapidly and been widely used in the 20th century. It has become an important symbol of the development of modern science and technology.

  • Definition and cause of pink circle on circuit board PCB

    After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.

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