12-Layer Rigid-Flex PCB Manufacturers

Our solutions are commonly regarded and trusted by users and can fulfill continuously developing financial and social demands for 12-Layer Rigid-Flex PCB,10-Layer Rigid-Flex PCB,4-Layer Rigid-Flex PCB,8-Layer Rigid-Flex PCB,6-Layer Rigid-Flex PCB, We've been hunting forward to forming effective business marriage with new clients from the near upcoming!
12-Layer Rigid-Flex PCB, When you are keen on any of our items following you view our product list, please feel free to make contact with us for inquiries. You'll be able to send us emails and get in touch with us for consultation and we shall respond for you as soon as we are able to. If it's convenient, you could find out our address in our web site and come to our enterprise. or additional information of our goods by yourself. We're generally ready to build lengthy and steady co-operation relations with any possible shoppers within the associated fields.

Hot Products

  • HI-8445PSI

    HI-8445PSI

    HI-8445PSI is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX25-3CSG324I

    XC6SLX25-3CSG324I

    The XC6SLX25-3CSG324I chip is a high-performance FPGA chip based on the famous American chip, mainly used in communication, data transmission, image processing, audio processing and other fields. As a mature chip product, XC6SLX25T-2CSG324I has high flexibility and programmability, which can meet the design requirements of various complex digital circuits.
  • XCVU33P-2FSVH2104E

    XCVU33P-2FSVH2104E

    ​XCVU33P-2FSVH2104E is a high-performance FPGA chip produced by XILINX. This chip is widely used in scientific research instruments and military equipment due to its high performance and reliability, supporting complex algorithm implementation and data processing tasks
  • 5M1270ZF256I5N

    5M1270ZF256I5N

    5M1270ZF256I5N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC3S400AN-4FGG400I

    XC3S400AN-4FGG400I

    XC3S400AN-4FGG400I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC6SLX100-2CSG484C

    XC6SLX100-2CSG484C

    XC6SLX100-2CSG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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