16-Layer FPGA PCB Manufacturers

Our company promises all users of the first-class products and the most satisfying post-sale service. We warmly welcome our regular and new customers to join us for 16-Layer FPGA PCB,FPGA PCB,28-Layer FPGA PCB,20-Layer FPGA PCB, we could solve our customer problems asap and do the profit for our customer. For those who need excellent company and top quality , pls choose us , thanks !
16-Layer FPGA PCB, Our goods are produced with the best raw materials. Every moment, we constantly improve the production programme. In order to ensure better quality and service, we have been focusing on the production process. We have now got high praise by partner. We're looking forward to establishing business relationship with you.

Hot Products

  • Ro4835LoPro PCB

    Ro4835LoPro PCB

    Ro4835LoPro PCB--For the processing of high cost performance SIW circuits, another advantage of using ro4835blopro and ro4835lopro materials is that the processing cost can be reduced through the standard FR-4 epoxy / glass process.
  • High speed Graphics Card PCB

    High speed Graphics Card PCB

    It has a number of leading technologies in the industry, including: the first uses a 0.13 micron manufacturing process, has 1GHz speed DDRII memory, perfectly supports Direct X9, and so on.The following is about High speed Graphics Card PCB related, I hope to help you better understand High speed Graphics Card PCB.
  • XC7S50-2FGGA484I

    XC7S50-2FGGA484I

    XC7S50-2FGGA484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU9P-1FLGA2577I

    XCVU9P-1FLGA2577I

    XCVU9P-1FLGA2577I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX16-2CPG196C

    XC6SLX16-2CPG196C

    XC6SLX16-2CPG196C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU13P-2FLGA2577E

    XCVU13P-2FLGA2577E

    ​XCVU13P-2FLGA2577E Virtex™ UltraScale+ ™ The device provides the highest performance and integrated functionality on the 14nm/16nm FinFET node. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements

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