16-Layer FPGA PCB Manufacturers

Our company promises all users of the first-class products and the most satisfying post-sale service. We warmly welcome our regular and new customers to join us for 16-Layer FPGA PCB,FPGA PCB,28-Layer FPGA PCB,20-Layer FPGA PCB, we could solve our customer problems asap and do the profit for our customer. For those who need excellent company and top quality , pls choose us , thanks !
16-Layer FPGA PCB, Our goods are produced with the best raw materials. Every moment, we constantly improve the production programme. In order to ensure better quality and service, we have been focusing on the production process. We have now got high praise by partner. We're looking forward to establishing business relationship with you.

Hot Products

  • XC7VX690T-1FFG1761I

    XC7VX690T-1FFG1761I

    XC7VX690T-1FFG1761I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7A50T-1CPG236I

    XC7A50T-1CPG236I

    XC7A50T-1CPG236I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7S50-2CSGA324I

    XC7S50-2CSGA324I

    ​XC7S50-2CSGA324I is an FPGA (Field Programmable Gate Array) launched by AMD/Xilinx, with the following features and specifications: Packaging form: CSPBGA-324 packaging is adopted, which is a surface mount packaging suitable for high-density integrated circuits
  • XC3S700A-4FGG484I

    XC3S700A-4FGG484I

    ​XC3S700A-4FGG484I is a high-performance, step-down DC-DC power module developed by Analog Devices, a leading semiconductor technology company. This device features a wide input voltage range of 6V to 36V and a maximum output current of 5A.
  • 5SGXMA3H3F35C4G

    5SGXMA3H3F35C4G

    ​5SGXMA3H3F35C4G is an FPGA (Field Programmable Gate Array) produced by Intel (formerly Altera). This FPGA has the following features and specifications:
  • XCKU3P-1FFVD900E

    XCKU3P-1FFVD900E

    ​XCKU3P-1FFVD900E is an FPGA chip launched by Xilinx, belonging to the Kintex UltraScale+series. This chip adopts a 20 nanometer process and has highly integrated characteristics, which can be widely used in high-performance computing, video processing

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