EM526 High Speed PCB Manufacturers

That has a positive and progressive attitude to customer's fascination, our enterprise constantly improves our merchandise high quality to meet the demands of customers and further focuses on safety, reliability, environmental requirements, and innovation of EM526 High Speed PCB,18 layer large size PCB,EM888 High Speed PCB,Oversized size PCB,TUC High Speed PCB, Through our hard work, we have always been on the forefront of clean technology product innovation. We are a green partner you can rely on. Contact us today for more information!
EM526 High Speed PCB, With high quality, reasonable price, on-time delivery and customized & personalized services to help customers achieve their goals successfully, our company has got praise in both domestic and foreign markets. Buyers are welcome to contact us.

Hot Products

  • XCVU35P-1FSVH2104E

    XCVU35P-1FSVH2104E

    ​XCVU35P-1FSVH2104E is an FPGA (Field Programmable Gate Array) product manufactured by Xilinx. Here is a brief introduction to the product:
  • XC7VX485T-1FFG1157C

    XC7VX485T-1FFG1157C

    XC7VX485T-1FFG1157C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EPM7128AETC100-10N

    EPM7128AETC100-10N

    EPM7128AETC100-10N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7A100T-1FGG484I

    XC7A100T-1FGG484I

    XC7A100T-1FGG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCF01SV0G20C

    XCF01SV0G20C

    XCF01SV0G20C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Heavy copper PCB

    Heavy copper PCB

    Printed circuit boards are usually bonded with a layer of copper foil on glass epoxy substrate. The thickness of copper foil is usually 18 μ m, 35 μ m, 55 μ m and 70 μ M. The most commonly used copper foil thickness is 35 μ M. When the weight of copper is more than 70UM, it is called heavy copper PCB

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