16-layer 2step HDI Rigid-Flex PCB Manufacturers

Good quality comes initial; company is foremost; small business is cooperation" is our business philosophy which is frequently observed and pursued by our business for 16-layer 2step HDI Rigid-Flex PCB,14-layer Enterprise SSD Rigid-Flex PCB,2step HDI Rigid-Flex PCB,Rigid-Flex PCB,SSD Rigid Flex PCB, We give priority to good quality and customer fulfillment and for this we follow stringent excellent control measures. We've in-house testing facilities where our goods are tested on each and every aspect at different processing stages. Owning to latest technologies, we facilitate our prospects with custom-made production facility.
16-layer 2step HDI Rigid-Flex PCB, High output volume, top quality, timely delivery and your satisfaction are guaranteed. We welcome all inquiries and comments. If you are interested in any of our items or have an OEM order to fulfill, make sure you feel free to contact us now. Working with us will save you money and time.

Hot Products

  • XC7VX690T-1FFG1927C

    XC7VX690T-1FFG1927C

    XC7VX690T-1FFG1927C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • MAX1363EUB+

    MAX1363EUB+

    MAX1363EUB+ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • AD9573ARUZ

    AD9573ARUZ

    AD9573ARUZ real-time clock chip ADI/Jardno package TSSOP16
  • XC9572-10TQG100C

    XC9572-10TQG100C

    XC9572-10TQG100C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • EP1K30FC256-3N

    EP1K30FC256-3N

    EP1K30FC256-3N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • HI-8596PSI

    HI-8596PSI

    HI-8596PSI is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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