2step HDI Rigid-Flex PCB Manufacturers

We generally continually give you quite possibly the most conscientious shopper company, and the widest variety of designs and styles with finest materials. These endeavours include the availability of customized designs with speed and dispatch for 2step HDI Rigid-Flex PCB,14-layer Enterprise SSD Rigid-Flex PCB,16-layer 2step HDI Rigid-Flex PCB,Rigid-Flex PCB,SSD Rigid Flex PCB, Inside our initiatives, we already have a lot of shops in China and our solutions have won praise from buyers all over the world. Welcome new and outdated buyers to contact us to the long run long lasting business relationships.
2step HDI Rigid-Flex PCB, All the imported machines effectively control and guarantee the machining precision for the products. Besides, we have a group of high-quality management personnels and professionals, who make the high-quality products and have the ability to develop new products to expand our market home and abroad. We sincerely expect customers come for a blooming business for both of us.

Hot Products

  • XCZU6EG-2FFVB1156I

    XCZU6EG-2FFVB1156I

    XCZU6EG-2FFVB1156I based on Xilinx ® UltraScale MPSoC architecture. This product integrates feature rich 64 bit quad core or dual core Arm ® Cortex-A53 and dual core Arm Cortex-R5F processing system (based on Xilinx) ® UltraScale MPSoC architecture).
  • XCKU035-1FFVA1156C

    XCKU035-1FFVA1156C

    ​XCKU035-1FFVA1156C is an FPGA chip launched by Xilinx and belongs to the Kintex UltraScale series. This chip adopts a 16 nanometer process and is packaged in FCBGA with 318150 logic units and 1156 pins, making it widely used in high-performance computing and communication applications
  • XC7K410T-L2FBG676I

    XC7K410T-L2FBG676I

    XC7K410T-L2FBG676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU5P-1FFVB676E

    XCKU5P-1FFVB676E

    ​XCKU5P-1FFVB676E is an FPGA (Field Programmable Gate Array) produced by AMD/Xilinx, belonging to Kintex ® UltraScale+FPGA series. This FPGA has multiple power options to achieve the best balance between required system performance and extremely low power consumption. It offers excellent cost-effectiveness, performance,
  • BCM56046B0IFSBLG

    BCM56046B0IFSBLG

    BCM56046B0IFSBLG is a complete DC-DC power supply system that includes a power inductor, power switch, and control circuitry, all housed in a compact surface-mount package. The device operates at a switching frequency of up to 2.25MHz, providing high efficiency and low noise performance. BCM56046B0IFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • ELIC Rigid-Flex PCB

    ELIC Rigid-Flex PCB

    ELIC Rigid-Flex PCB is the interconnection hole technology in any layer. This technology is the patent process of Matsushita Electric Component in Japan. It is made of short fiber paper of DuPont's "poly aramid" product thermount, which is impregnated with high-function epoxy resin and film. Then it is made of laser hole forming and copper paste, and copper sheet and wire are pressed on both sides to form a conductive and interconnected double-sided plate. Because there is no electroplated copper layer in this technology, the conductor is only made of copper foil, and the thickness of the conductor is the same, which is conducive to the formation of finer wires.

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