R03010 Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • XCKU115-2FLVB1760E

    XCKU115-2FLVB1760E

    XCKU115-2FLVB1760E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC4VLX25-10FFG668C

    XC4VLX25-10FFG668C

    XC4VLX25-10FFG668C is a powerful and high-performance SoC FPGA chip. ‌‌
  • XC6SLX75T-2FGG484I

    XC6SLX75T-2FGG484I

    XC6SLX75T-2FGG484I is a highly flexible and programmable # FPGA chip #. Its 268 input/output ports provide powerful circuit connectivity, enabling the chip to achieve efficient signal transmission and data processing in various applications.
  • ISOLA FR408HR PCB

    ISOLA FR408HR PCB

    The development trend of high-speed circuit boards has reached an annual output value of 30 billion yuan. In high-speed circuit design, it is inevitable to choose the raw materials of the circuit board. The density of glass fiber directly produces the largest difference in the impedance of the circuit board, and the value of communication is also different. The following is about ISOLA FR408HR PCB related, I hope to help you better understand ISOLA FR408HR PCB.
  • XCVU13P-2FHGB2104E

    XCVU13P-2FHGB2104E

    XCVU13P-2FHGB2104E is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 1.3 million logic cells, 50 Mb of block RAM, and 624 Digital Signal Processing (DSP) slices, making it ideal for high-performance applications such as high-performance computing, machine vision, and video processing. It operates on a 0.85V to 0.9V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 1 GHz. The device comes in a flip-chip BGA (FHGB2104E) package with 2104 pins, providing high pin-count connectivity for a variety of applications. XCVU13P-2FHGB2104E is commonly used in advanced systems such as wireless communications, cloud computing, and high-speed networking. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it a top choice for mission-critical applications where reliability and performance are critical.
  • EM-526 PCB

    EM-526 PCB

    Four layer EM-526 PCB is a kind of multilayer printed circuit board, which has both rigid layer and flexible layer. A typical (four layer) rigid flex printed circuit board has a polyimide core with copper foil on both sides.

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