RT6010 Manufacturers

Our growth depends within the innovative equipment, fantastic talents and repeatedly strengthened technology forces for RT6010,RT6002,RT6006,RT5880,RT5870, Our aim will be to assistance shoppers comprehend their goals. We've been earning good endeavours to obtain this win-win scenario and sincerely welcome you to definitely sign up for us.
RT6010, Our company offers the full range from pre-sales to after-sales service, from product development to audit the use of maintenance, based on strong technical strength, superior product performance, reasonable prices and perfect service, we will continue to develop, to provide the high-quality products and services, and promote lasting cooperation with our customers, common development and create a better future.

Hot Products

  • Robot 3step HDI PCB

    Robot 3step HDI PCB

    The heat resistance of the Robot 3step HDI PCB is an important item in the reliability of HDI. The thickness of the Robot 3step HDI Circuit Board becomes thinner and thinner, and the requirements for its heat resistance are getting higher and higher. The advancement of the lead-free process has also increased the requirements for the heat resistance of HDI boards. Since the HDI board is different from the ordinary multilayer through-hole PCB board in terms of layer structure, the heat resistance of the HDI board is the same as that of ordinary multilayer through-hole PCB board is different.
  • XC7Z035-2FFG900I

    XC7Z035-2FFG900I

    ​XC7Z035-2FFG900I ARM® Cortex ™- The A9 processor is available in dual core (Zynq-7000) and single core (Zynq-7000S) Cortex-A9 configurations, providing integrated 28nm programmable logic per watt, with power consumption and performance levels surpassing discrete processors and FPGA systems
  • 5CGXFC5C6F23I7N

    5CGXFC5C6F23I7N

    ​5CGXFC5C6F23I7N The Cyclone ® V GX device can simultaneously meet the continuously decreasing requirements of power consumption, cost, and time to market, as well as the increasing bandwidth requirements for large-scale and cost sensitive applications
  • ADSP-21060LCW-160

    ADSP-21060LCW-160

    ADSP-21060LCW-160 Package: 240-BFCQFP bare pad Working temperature: -40-100 Lot number: 2023+ Quantity: 260PCS in the global hot sale
  • XC7VX690T-2FFG1927I

    XC7VX690T-2FFG1927I

    The XC7VX690T-2FFG1927I field programmable gate array is a device implemented through stacked silicon interconnect (SSI) technology, which can meet system application requirements. Virtex-7 can be used for applications such as 10G to 100G networks, portable radar, and ASIC prototype development. The Virtex-7 device can also meet various system requirements, from compact and cost sensitive large-scale applications to ultra-high end connection bandwidth, logic capacity, and signal processing capabilities
  • HI-8448PQI

    HI-8448PQI

    ​The HI-8448PQI is a highly specialized integrated circuit (IC) designed for receiving ARINC 429 data bus signals. This device contains 8 independent ARINC 429 line receivers in a single package, offering a compact solution for avionics and other applications requiring multiple ARINC 429 interfaces.

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