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The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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  • 5CGTFD9E5F35C7N

    5CGTFD9E5F35C7N

    ​5CGTFD9E5F35C7N is an FPGA (Field Programmable Gate Array) chip belonging to the Cyclone V GT series of the Altera brand. This chip is packaged in 1152-BGA and is suitable for various complex digital signal processing and communication applications. The main features of the 5CGTFD9E5F35C7N chip include high-performance processing capability, low-power design, rich I/O interfaces, and programmability. Specifically:
  • XCKU035-2FBVA676E

    XCKU035-2FBVA676E

    XCKU035-2FBVA676E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX1140T-2FLG1926I

    XC7VX1140T-2FLG1926I

    XC7VX1140T-2FLG1926I is a powerful and high-performance FPGA device. Suitable for various complex hardware design and data processing tasks. It supports multiple communication interfaces and DDR3 memory interfaces, providing convenience for system integration. In addition, OpenCL programming also provides designers with greater flexibility, enabling them to better meet different application requirements.
  • XC7K325T-L2FBG900E

    XC7K325T-L2FBG900E

    ​XC7K325T-L2FBG900E is a model of the Xilinx Kintex-7 family of field-programmable gate arrays (FPGAs). These FPGAs offer high-performance processing capabilities and are widely used in various applications such as wireless communication, high-speed connectivity, and video processing.
  • 5M2210ZF256C5N

    5M2210ZF256C5N

    5M2210ZF256C5N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • HI-8448PQI

    HI-8448PQI

    ​The HI-8448PQI is a highly specialized integrated circuit (IC) designed for receiving ARINC 429 data bus signals. This device contains 8 independent ARINC 429 line receivers in a single package, offering a compact solution for avionics and other applications requiring multiple ARINC 429 interfaces.
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  • Reviews

  • How to design the lamination when designing a 4-layer PCB circuit board

    When designing a four layer PCB circuit board, how to design the stack? Theoretically, there can be three schemes

  • Film selection of FPC circuit board

    There are three methods of resist coating: liquid resist coating method and FPC resist coating method for circuit board

  • Plug hole processing technology sharing

    The term "plug hole" is not a new term for the printed circuit board industry.

  • What is the future development prospect of chips in China

    Chips are also known as integrated circuits and microcircuits. Mobile phone chips are an important branch of them. All functions of smart phones currently used by everyone depend on mobile phone chips. Mobile phones without chips are even worse than bricks. It can be seen that mobile phones rely heavily on chips. Chip technology directly affects the future development of mobile communications.

  • The advantages of heavy copper PCB

    The advantages of heavy copper PCB make it the top priority for the development of high-power circuits. The heavy copper concentration can handle high power and high heat, which is why high-power circuits have been developed using this technology. Such circuits cannot be developed with low-copper concentration PCBs because they cannot withstand the huge thermal stresses caused by high currents and flowing currents.

  • Welding process of FPC circuit board

    At present, there are two general FPC welding processes, one is tin press welding, and the other is manual drag welding.

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