RT5870 Manufacturers

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Hot Products

  • XCKU3P-2FFVA676I

    XCKU3P-2FFVA676I

    ​XCKU3P-2FFVA676I is an FPGA (Field Programmable Gate Array) device produced by Xilinx, belonging to the Kintex UltraScale+series. This FPGA has the following features and specifications
  • 20-layer PCB

    20-layer PCB

    20-layer PCB--The increase in the density of integrated circuit packaging has led to a high concentration of interconnect lines, which makes the use of multiple substrates a necessity. In the layout of the printed circuit, unforeseen design problems have appeared, such as noise, stray capacitance, and crosstalk. The following is about 20 layer Pentium Motherboard related, I hope to help you better understand 20-layer PCB.
  • XC9536-10VQG44I

    XC9536-10VQG44I

    XC9536-10VQG44I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Robot 3step HDI PCB

    Robot 3step HDI PCB

    The heat resistance of the Robot 3step HDI PCB is an important item in the reliability of HDI. The thickness of the Robot 3step HDI Circuit Board becomes thinner and thinner, and the requirements for its heat resistance are getting higher and higher. The advancement of the lead-free process has also increased the requirements for the heat resistance of HDI boards. Since the HDI board is different from the ordinary multilayer through-hole PCB board in terms of layer structure, the heat resistance of the HDI board is the same as that of ordinary multilayer through-hole PCB board is different.
  • BCM65800IFBGH

    BCM65800IFBGH

    BCM65800IFBGH is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP4SGX180KF40C3N

    EP4SGX180KF40C3N

    EP4SGX180KF40C3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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