XC7K70T-1FBG484I Manufacturers

"Control the quality by the details, show the strength by quality". Our company has strived to establish a highly efficient and stable staff team and explored an effective quality control process for XC7K70T-1FBG484I, Welcome any inquiry to our firm. We will be happy to ascertain helpful business enterprise relationships along with you!
XC7K70T-1FBG484I, Our Company policy is "quality first, to be better and stronger, sustainable development" . Our pursuit goals is "for society, customers, employees, partners and enterprises to seek reasonable benefit". We aspirate to do cooperate with all different the auto parts manufacturers, repair shop, auto peer , then create a beautiful future! Thank you for taking time to browse our website and we would welcome any suggestions you may have that can help us to improve our site.

Hot Products

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    XC7A15T-2FTG256I

    XC7A15T-2FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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    XC7Z020-2CLG400E

    ​XC7Z020-2CLG400E is an FPGA SoC (Field Programmable Gate Array with System on a Chip) produced by AMD/Xilinx, also known as Programmable Logic Integrated Circuit. This product has the following features and specifications:
  • XC7Z045-2FBG676I

    XC7Z045-2FBG676I

    XC7Z045-2FBG676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC9536XL-10VQG44C

    XC9536XL-10VQG44C

    XC9536XL-10VQG44C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5CEFA9F23I7N

    5CEFA9F23I7N

    5CEFA9F23I7N adopts the FBGA-484 packaging method. This packaging has good heat dissipation performance and reliability, and can effectively protect the internal circuit of the chip.
  • XC2S50E-6FTG256C

    XC2S50E-6FTG256C

    XC2S50E-6FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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