TMM10 Manufacturers

Our intention would be to provide top quality products and solutions at competitive charges, and top-notch support to customers around the world. We have been ISO9001, CE, and GS certified and strictly adhere to their quality specifications for TMM10,RT6002,RT6006,RT6010,RT5880, Our organization has been devoting that "customer first" and committed to helping clients expand their small business, so that they become the Big Boss !
TMM10, Certainly, competitive price, suitable package and timely delivery might be assured as per customers' demands. We sincerely hope to build business relationship with you on the basis of mutual benefit and profit in the very near future. Warmly welcome to contact us and become our direct cooperators.

Hot Products

  • BCM54616SC0KFBG

    BCM54616SC0KFBG

    BCM54616SC0KFBG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • IRFH5006TRPBF

    IRFH5006TRPBF

    IRFH5006TRPBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU7P-2FLVA2104I

    XCVU7P-2FLVA2104I

    The XCVU7P-2FLVA2104I device provides the highest performance and integrated functionality on 14nm/16nm FinFET nodes. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements. It also provides a virtual single-chip design environment to provide registered routing lines between chips to achieve operation above 600MHz and provide richer and more flexible clocks.
  • 10AS048H3F34E2SG

    10AS048H3F34E2SG

    10AS048H3F34E2SG is an FPGA chip with excellent performance and broad application prospects. It features high performance, low power consumption, flexibility, and reliability, making it suitable for application scenarios that require these characteristics
  • XC7K160T-3FFG676E

    XC7K160T-3FFG676E

    XC7K160T-3FFG676E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC3S200A-4FTG256C

    XC3S200A-4FTG256C

    XC3S200A-4FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

Send Inquiry