7-step HDI PCB Manufacturers

Our enterprise insists all along the quality policy of "product high-quality is base of organization survival; customer gratification will be the staring point and ending of an company; persistent improvement is eternal pursuit of staff" and also the consistent purpose of "reputation very first, purchaser first" for 7-step HDI PCB,HDI PCB,2-step HDI PCB,3-step HDI PCB,4-step HDI PCB, Hope we can easily generate a more glorious potential along with you by means of our endeavours within the long run.
7-step HDI PCB, With the goal of "zero defect". To care for the environment, and social returns, care employee social responsibility as own duty. We welcome friends from all over the world to visit and guide us so that we can achieve the win-win goal together.

Hot Products

  • XC7VX415T-2FFG1158I

    XC7VX415T-2FFG1158I

    ​XC7VX415T-2FFG1158I Field Programmable Gate Array (FPGA) is a device that uses stacked silicon interconnect (SSI) technology and can meet the system requirements of various applications. FPGA is a semiconductor device based on a configurable logic block (CLB) matrix connected through a programmable interconnect system. Suitable for applications such as 10G to 100G networks, portable radar, and ASIC prototype design.
  • 17 layers ultra small size coil PCB

    17 layers ultra small size coil PCB

    17 layers ultra small size coil PCB--Compared with the module board, the coil board is more portable, small in size and light in weight. It has a coil that can be opened for easy access and a wide frequency range. The circuit pattern is mainly winding, and the circuit board with etched circuit instead of traditional copper wire turns is mainly used in inductive components. It has a series of advantages such as high measurement, high accuracy, good linearity, and simple structure.The following is about 17 layers ultra small size coil board, I hope to help you better understand 17 layers ultra small size coil board.
  • 18 layer 3step HDI PCB

    18 layer 3step HDI PCB

    18 layer 3step HDI PCB refers to the HDI circuit board with more than 2 levels, usually 3 + N + 3 or 4 + N + 4 or 5 + N + 5 structure. The blind hole uses a laser, and the hole copper is about 15UM.The following is about 18 layer 3step HDI circuit board related, I hope to help you better understand 18 layer 3step HDI circuit board.
  • XCVU13P-2FHGA2104E

    XCVU13P-2FHGA2104E

    ​XCVU13P-2FHGA2104E is a high-performance FPGA chip produced by Xilinx, belonging to the Virtex UltraScale+series. This chip has the following main features
  • MT40A512M16TB-062E:R

    MT40A512M16TB-062E:R

    MT40A512M16TB-062E:R is a high-speed dynamic random access memory that is configured internally as 8 sets of DRAM in x16 configuration and 16 sets of DRAM in x4 and x8 configuration. DDR4 SDRAM uses the 8n refresh architecture to achieve high-speed operation. The 8n prefetch architecture is combined with an interface designed to transmit two data words per clock cycle on the I/O pins.
  • EP2C8F256C8N

    EP2C8F256C8N

    EP2C8F256C8N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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