6-layer any interconnection PCB Manufacturers

We have been proud from the higher consumer gratification and wide acceptance due to our persistent pursuit of high quality both on product or service and service for 6-layer any interconnection PCB,8-layer 3Step HDI PCB,Cross Blind Buried Hole PCB,HDI PCB,4Step HDI PCB, With the eternal goal of "continuous quality improvement, customer satisfaction", we are sure that our product quality is stable and reliable and our products are best-selling at home and abroad.
6-layer any interconnection PCB, We will supply much better products with diversified designs and professional services. At the same time, welcome OEM, ODM orders, invite friends at home and abroad together common development and achieve win-win, integrity innovation, and expand business opportunities! If you have any question or need more information please feel free to contact us. We are looking forward to receiving your enquiries soon.

Hot Products

  • BCM56046B0IFSBLG

    BCM56046B0IFSBLG

    BCM56046B0IFSBLG is a complete DC-DC power supply system that includes a power inductor, power switch, and control circuitry, all housed in a compact surface-mount package. The device operates at a switching frequency of up to 2.25MHz, providing high efficiency and low noise performance. BCM56046B0IFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM65936A0IFSBG

    BCM65936A0IFSBG

    BCM65936A0IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX45T-2CSG484C

    XC6SLX45T-2CSG484C

    XC6SLX45T-2CSG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX100-3FGG676I

    XC6SLX100-3FGG676I

    XC6SLX100-3FGG676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • TU102-875-A1

    TU102-875-A1

    TU102-875-A1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC2S200-5PQG208C

    XC2S200-5PQG208C

    XC2S200-5PQG208C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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