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XCVU7P-1FLVA2104E, We strive for excellence, constant improvement and innovation, is committed to make us the "customer trust" and the "first choice of engineering machinery accessories brand" suppliers. Choose us, sharing a win-win situation!

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    XC7VX1140T-L2FL1928E

    XC7VX1140T-L2FL1928E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10M08DFV81I7G

    10M08DFV81I7G

    10M08DFV81I7G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU9P-2FLGC2104I

    XCVU9P-2FLGC2104I

    ​XCVU9P-2FLGC2104I (note: in search results, XCVU9P-2FLGA2104I or XCVU9P-2FLGB2104I are more common, but I will answer based on the model you provided and assume it may be a specific version or a typo) may be an FPGA (Field Programmable Gate Array) chip in Xilinx's Virtex UltraScale+series
  • RO3003 PCB

    RO3003 PCB

    The delay per unit inch on the PCB is 0.167ns. However, if there are more vias, more device pins, and more constraints set on the network cable, the delay will increase. Generally, the signal rise time of high-speed logic devices is about 0.2ns. If there are GaAs chips on the board, the maximum wiring length is 7.62mm. The following is about RO3003 PCB related, I hope to help you better understand RO3003 PCB.
  • XAZU3EG-1SFVC784Q

    XAZU3EG-1SFVC784Q

    XAZU3EG-1SFVC784Q is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU7P-2FLVA2104I

    XCVU7P-2FLVA2104I

    The XCVU7P-2FLVA2104I device provides the highest performance and integrated functionality on 14nm/16nm FinFET nodes. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements. It also provides a virtual single-chip design environment to provide registered routing lines between chips to achieve operation above 600MHz and provide richer and more flexible clocks.
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