XCVU23P-3FSVJ1760I Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • BCM53343A0KFSBLG

    BCM53343A0KFSBLG

    BCM53343A0KFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX45-2FGG676C

    XC6SLX45-2FGG676C

    XC6SLX45-2FGG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Pressfit Hole PCB

    Pressfit Hole PCB

    For example, from the perspective of production process testing, IC testing is generally divided into chip testing, finished product testing, and inspection testing. Unless otherwise required, chip testing generally only conducts DC testing, and finished product testing can have either AC testing or DC testing. In more cases, both tests are available.The following is about Pressfit Hole PCB related, I hope to help you better understand Pressfit Hole PCB.
  • XCVU27P-3FSGA2577E

    XCVU27P-3FSGA2577E

    ​XCVU27P-3FSGA2577E is an electronic component, specifically a Xilinx brand FPGA (Field Programmable Logic Device). Here is a detailed introduction to it:
  • XC7VX485T-2FFG1157I

    XC7VX485T-2FFG1157I

    XC7VX485T-2FFG1157I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • ADS1112IDRCR

    ADS1112IDRCR

    ADS1112IDRCR is a precision analog-to-digital converter (ADC) developed by Texas Instruments, a leading semiconductor technology company. This device features a 16-bit resolution, which provides high-precision conversion for analog signals. The device operates on a single power supply ranging from 2.0V to 5.5V and consumes very low power.

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