XCVU13P-2FLGA2577E Manufacturers

we can easily provide top quality solutions, competitive value and best client company. Our destination is "You come here with difficulty and we provide you a smile to take away" for XCVU13P-2FLGA2577E, Our ultimate objective is always to rank as a top brand also to lead as a pioneer inside our field. We're sure our prosperous experience in tool generation will gain customer's trust, Wish to co-operate and co-create an even better upcoming with you!
XCVU13P-2FLGA2577E, Ensuring high product quality by choosing the best suppliers, we have also implemented comprehensive quality control processes throughout our sourcing procedures. Meanwhile, our access to a large range of factories, coupled with our excellent management, also ensures that we can quickly fill your requirements at the best prices, regardless the order size.

Hot Products

  • XCKU15P-3FFVA1760E

    XCKU15P-3FFVA1760E

    The XCKU15P-3FFVA1760E device can achieve a balance between required system performance and extremely low power consumption, while supporting packet processing and DSP intensive functions. It is an ideal choice for wireless MIMO technology, Nx100G wired networks, as well as data center networks and storage acceleration application
  • BCM54380C1KFBG

    BCM54380C1KFBG

    BCM54380C1KFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM57762A1KMLG

    BCM57762A1KMLG

    BCM57762A1KMLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP4SGX230FF35C4G

    EP4SGX230FF35C4G

    EP4SGX230FF35C4G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC5VLX220T-1FF1738I

    XC5VLX220T-1FF1738I

    XC5VLX220T-1FF1738I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 8OZ Heavy copper PCB

    8OZ Heavy copper PCB

    In PCB proofing, a layer of copper foil is bonded to the outer layer of FR-4. When the copper thickness is = 8oz, it is defined as a 8OZ heavy copper pcb. The 8OZ heavy copper pcb has excellent extension performance, high temperature, low temperature, and corrosion resistance, which allows electronic equipment products to have a longer service life, and also greatly helps the size of electronic equipment to be simplified. In particular, electronic products that need to run higher voltages and currents require 8OZ heavy copper pcb.

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