XCVU13P-2FLGA2577E Manufacturers

we can easily provide top quality solutions, competitive value and best client company. Our destination is "You come here with difficulty and we provide you a smile to take away" for XCVU13P-2FLGA2577E, Our ultimate objective is always to rank as a top brand also to lead as a pioneer inside our field. We're sure our prosperous experience in tool generation will gain customer's trust, Wish to co-operate and co-create an even better upcoming with you!
XCVU13P-2FLGA2577E, Ensuring high product quality by choosing the best suppliers, we have also implemented comprehensive quality control processes throughout our sourcing procedures. Meanwhile, our access to a large range of factories, coupled with our excellent management, also ensures that we can quickly fill your requirements at the best prices, regardless the order size.

Hot Products

  • XCKU3P-L1SFVB784I

    XCKU3P-L1SFVB784I

    XCKU3P-L1SFVB784I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM5389IFBG

    BCM5389IFBG

    BCM5389IFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • HI-8586PSI

    HI-8586PSI

    HI-8586PSI Packing: Pipe fittings Product status: For sale Technical parameter Protocol ARINC429 Actuator - Number of receivers 2/0 Power supply voltage ±12V ~ 15V Specification parameter Operating temperature -40°C ~ 85°C Physical type Type driver Product number HI-8586 Package parameters: Product Mounting type Surface mount type Package 8-SOIC (0.154 quot; , 3.90mm wide) bare pad Vendor device package 8-ESOIC
  • Thin Film PCB

    Thin Film PCB

    Thin Film PCB has good thermal and electrical properties, and is an excellent material for power LED packaging. Thin film circuit board is especially suitable for packaging structures such as multi-chip (MCM) and substrate directly bonded chip (COB); it can also be used as other high-power The heat dissipation circuit board of the power semiconductor module.
  • XC6SLX9-2CSG225C

    XC6SLX9-2CSG225C

    XC6SLX9-2CSG225C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S1400A-4FTG256I

    XC3S1400A-4FTG256I

    XC3S1400A-4FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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