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The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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    Thin Film Circuit Board

    Thin film circuit board has good thermal and electrical properties, and is an excellent material for power LED packaging. Thin film circuit board is especially suitable for packaging structures such as multi-chip (MCM) and substrate directly bonded chip (COB); it can also be used as other high-power The heat dissipation circuit board of the power semiconductor module.
  • 10AS016E3F29I2SG

    10AS016E3F29I2SG

    10AS016E3F29I2SG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • EP4SGX180FF35I4N

    EP4SGX180FF35I4N

    EP4SGX180FF35I4N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • EP1S80F1020C5N

    EP1S80F1020C5N

    EP1S80F1020C5N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5CGXFC7D6F27I7N

    5CGXFC7D6F27I7N

    5CGXFC7D6F27I7N is a field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor company. This device features 622,080 logic elements, 27 Mb of RAM, and 1,500 user input/output pins. It operates on a 1.0V to 1.2V power supply and supports various I/O standards such as single-ended I/O,
  • 25G Optical Module PCB

    25G Optical Module PCB

    Optical module products began to develop in two aspects. One is the hot-swappable optical module, which became the earliest hot-swap module GBIC. One is miniaturization, using an LC head, which is directly cured on the circuit board and becomes an SFF.The following is about 25G Optical Module PCB related, I hope to help you better understand 25G Optical Module PCB.
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  • The Evolution and Impact of Integrated Circuits in Modern Electronics

    The concept of integrated circuits traces its roots back to the late 1950s and early 1960s. Jack Kilby, an engineer at Texas Instruments, and Robert Noyce, co-founder of Fairchild Semiconductor and later Intel, independently conceived the idea of integrating multiple electronic components onto a single semiconductor substrate.

  • PCB modular layout ideas

    Faced with the increasingly high integration of hardware platforms and more and more complex electronic systems, the PCB layout should have a modular thinking, which requires the use of modularity in the design of hardware schematics and PCB wiring. , Structured design method. As a hardware engineer, on the premise of understanding the overall architecture of the system, first of all, we should consciously merge modular design ideas in the schematic diagram and PCB wiring design, combined with the actual situation of the PCB, plan the basic idea of PCB layout.

  • According to the number of microelectronic devices integrated on a chip, integrated circuits can be divided into the following categories:

    According to the number of microelectronic devices integrated on a chip, integrated circuits can be divided into the following categories:

  • What is the difference between chips, semiconductors and integrated circuits?

    Semiconductors refer to materials with conductivity between conductor and insulator at room temperature. Common semiconductor materials include silicon, germanium, gallium arsenide, etc. Silicon is the most influential one in the application of various semiconductor materials

  • What products do semiconductors contain

    Semiconductor products cover everything from basic diodes and transistors to complex integrated circuits and microprocessors. These products play a crucial role in electronic devices, including transistors for amplifying and switching current, diodes for rectifying and stabilizing voltage, and memory devices such as DRAM and flash memory for storing and processing data. Integrated circuits,

  • What does semiconductor mean

    Semiconductors are mainly composed of four parts: integrated circuits, optoelectronic devices, discrete devices, and sensors. However, since integrated circuits account for 80% of them, laypeople generally consider integrated circuits as semiconductors. In integrated circuits, they are further divided into microprocessors, memory, logic devices, and analog devices. These small box like things are actually what we commonly refer to as chips.

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