TSM-DS3 high frequency PCB Manufacturers

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TSM-DS3 high frequency PCB, Our company insists on the principle of "Quality First, Sustainable Development", and takes "Honest Business, Mutual Benefits" as our developable goal. All members sincerely thank all old and new customers' support. We'll keep working hard and offering you the highest-quality goods and service.

Hot Products

  • 5M570ZT144C5N

    5M570ZT144C5N

    ​The 5M570ZT144C5N low-cost and low-power CPLD provides greater density and I/O per footprint. The density of MAX V devices ranges from 40 to 2210 logic elements (32 to 1700 equivalent macro units) and up to 271 I/O, providing programmable solutions for I/O expansion, bus and protocol bridging, power monitoring and control, FPGA configuration, and analog IC interfaces.
  • XC7VX415T-2FFG1158C

    XC7VX415T-2FFG1158C

    XC7VX415T-2FFG1158C is a type of FPGA (Field Programmable Gate Array) made by Xilinx. This specific FPGA has 1.34 million logic cells, operates at a speed of up to 800 MHz, and features 16 Transceivers,
  • XCVU37P-3FSVH2892E

    XCVU37P-3FSVH2892E

    XCVU37P-3FSVH2892E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7S75-2FGGA676I

    XC7S75-2FGGA676I

    ​XC7S75-2FGGA676I is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, manufactured using a 28nm process. This chip has 48000 logic units and 76800 programmable units, providing high-performance digital signal processing and data processing capabilities.
  • XC6SLX16-2CPG196C

    XC6SLX16-2CPG196C

    XC6SLX16-2CPG196C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10 Layer 4Step HDI PCB

    10 Layer 4Step HDI PCB

    HDI is the English abbreviation of High Density Interconnector, high-density interconnect (HDI) manufacturing printed circuit board. The printed circuit board is a structural element formed by insulating material supplemented by conductor wiring. The following is about 10 Layer 4Step HDI PCB related, I hope to help you better understand 10 Layer 4Step HDI PCB.

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