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8step HDI PCB Manufacturers

Using a complete scientific high quality management program, superior high quality and superior faith, we acquire great reputation and occupied this industry for 8step HDI PCB,28-layer 3step HDI PCB,32-layer 3step HDI PCB,20-layer 6step HDI PCB,2step HDI PCB, 1st business enterprise, we find out each other. Even further business enterprise, the trust is getting there. Our enterprise always at your services at any time.
8step HDI PCB, With more than 9 years of experience and a skilled team, now we have exported our items to many countries and regions all over the world. We welcome customers, business associations and friends from all parts of the world to contact us and seek cooperation for mutual benefits.

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  • EM-890K HDI PCB

    EM-890K HDI PCB

    HDI boards are generally manufactured using a lamination method. The more laminations, the higher the technical level of the board. Ordinary HDI boards are basically laminated one time. High-level HDI adopts two or more layered technologies. At the same time, advanced PCB technologies such as stacked holes, electroplated holes, and laser direct drilling are used.The following is about EM-890K HDI PCB related, I hope to help you better understand EM-890K HDI PCB.
  • XC6SLX9-2FTG256I

    XC6SLX9-2FTG256I

    XC6SLX9-2FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • TG250 PCB

    TG250 PCB

    Tg250 PCB is made of polyimide material. It can withstand high temperature for a long time and does not deform at 230 degrees. It is suitable for high temperature equipment, and its price is slightly higher than that of ordinary FR4
  • XC2V250-4CSG144I

    XC2V250-4CSG144I

    XC2V250-4CSG144I is a field programmable gate array (FPGA) chip manufactured by Xilinx
  • XC5VLX50T-2FFG665C

    XC5VLX50T-2FFG665C

    XC5VLX50T-2FFG665C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCF02SVOG20C

    XCF02SVOG20C

    XCF02SVOG20C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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  • The source of the name of the HDI Board

    HDI in HDI Board is the abbreviation of High Density Interconnector. It is a kind of (technology) for producing printed circuit boards. It uses micro-blind and buried via technology for a circuit board with a relatively high line distribution density. HDI is a compact product designed for small-capacity users.

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