8 layer 2Step HDI PCB Manufacturers

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Hot Products

  • FR406 Rigid Flex PCB

    FR406 Rigid Flex PCB

    The combination of Rigid-Flex boards is widely used, for example: high-end smart phones such as iPhone; high-end Bluetooth headsets (requires signal transmission distance); smart wearable devices; robots; drones; curved displays; high-end industrial control equipment; Can see its figure. The following is about 6 Layer FR406 Rigid Flex PCB related, I hope to help you better understand 6 Layer FR406 Rigid Flex PCB.
  • 5CGXFC5C6F23I7N

    5CGXFC5C6F23I7N

    ​5CGXFC5C6F23I7N The Cyclone ® V GX device can simultaneously meet the continuously decreasing requirements of power consumption, cost, and time to market, as well as the increasing bandwidth requirements for large-scale and cost sensitive applications
  • TU-768 Rigid-Flex PCB

    TU-768 Rigid-Flex PCB

    As TU-768 Rigid-Flex PCB design is widely used in many industrial fields, in order to ensure a high first-time success rate, it is very important to learn the terms, requirements, processes and best practices of rigid flex design. TU-768 Rigid-Flex PCB can be seen from the name that rigid flex combination circuit is composed of rigid board and flexible board technology. This design is to connect the multilayer FPC to one or more rigid boards internally and / or externally.
  • LTM4620IV#PBF

    LTM4620IV#PBF

    LTM4620IV#PBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX4-3CPG196C

    XC6SLX4-3CPG196C

    XC6SLX4-3CPG196C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP2C50F672C8N

    EP2C50F672C8N

    EP2C50F672C8N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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