24G Rogers mixed PCB Manufacturers

MT40A512M16TB-062E:R is a high-speed dynamic random access memory that is configured internally as 8 sets of DRAM in x16 configuration and 16 sets of DRAM in x4 and x8 configuration. DDR4 SDRAM uses the 8n refresh architecture to achieve high-speed operation. The 8n prefetch architecture is combined with an interface designed to transmit two data words per clock cycle on the I/O pins.

18 layer 3step HDI PCB refers to the HDI circuit board with more than 2 levels, usually 3 + N + 3 or 4 + N + 4 or 5 + N + 5 structure. The blind hole uses a laser, and the hole copper is about 15UM.The following is about 18 layer 3step HDI circuit board related, I hope to help you better understand 18 layer 3step HDI circuit board.

​EP2AGX125EF35I5N is a programmable logic integrated IC chip provided by the Altera/Altera brand. This chip belongs to the logic and timing device category and has the following characteristics:

XC6SLX75-2FGG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

Multilayer precision PCB--The manufacturing method of multilayer board is generally made by the inner layer pattern first, and then the single or double-sided substrate is made by printing and etching method, which is included in the specified interlayer, and then heated, pressurized and bonded. As for the subsequent drilling, it is the same as the plating through-hole method of double-sided board.

EP2SGX130GF1508C3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.