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Hot Products

  • 10AX066H3F34I2LG

    10AX066H3F34I2LG

    10AX066H3F34I2LG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • CL21B106K0QNNNE

    CL21B106K0QNNNE

    CL21B106K0QNNNE is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Meg7 High speed PCB

    Meg7 High speed PCB

    Definition of Meg7 High speed PCB: it is generally believed that if the frequency of the digital logic circuit reaches 45,50MHz and the circuit working at this frequency accounts for a certain proportion of the whole system (such as 1amp 3), it will become a high speed circuit.
  • 24 Layers ELIC HDI PCB

    24 Layers ELIC HDI PCB

    24 Layers ELIC HDI PCB--When a printed circuit board is made into a final product, integrated circuits, transistors (triodes, diodes), passive components (such as resistors, capacitors, connectors, etc.) and various other electronic parts are mounted on it. The following is about 24 Layers of Any Connected HDI related, I hope to help you better understand 24 Layers of Any Connected HDI.
  • XC6SLX25-3CSG324C

    XC6SLX25-3CSG324C

    ​XC6SLX25-3CSG324C is a field programmable gate array (FPGA) launched by Xilinx, belonging to the Spartan-6 series, with the following features and functions:
  • Robot 3step HDI PCB

    Robot 3step HDI PCB

    The heat resistance of the Robot 3step HDI PCB is an important item in the reliability of HDI. The thickness of the Robot 3step HDI Circuit Board becomes thinner and thinner, and the requirements for its heat resistance are getting higher and higher. The advancement of the lead-free process has also increased the requirements for the heat resistance of HDI boards. Since the HDI board is different from the ordinary multilayer through-hole PCB board in terms of layer structure, the heat resistance of the HDI board is the same as that of ordinary multilayer through-hole PCB board is different.

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