XCZU7EV-2FBVB900I Manufacturers

We also supply merchandise sourcing and flight consolidation companies. We now have our very own manufacturing facility and sourcing business. We could present you with almost every kind of product relevant to our solution array for XCZU7EV-2FBVB900I, Only for accomplish the good-quality product to meet customer's demand, all of our products have been strictly inspected before shipment.
XCZU7EV-2FBVB900I, We mainly sell in wholesale, with the most popular and easy ways of making payment, which are paying via Money Gram, Western Union, Bank Transfer and Paypal. For any further talk, just feel free to contact our salesmen, who are really good and knowledgeable about our prodcuts.

Hot Products

  • EPM1270F256I5N

    EPM1270F256I5N

    EPM1270F256I5N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • ST115G PCB

    ST115G PCB

    ST115G PCB -- with the development of integrated technology and microelectronic packaging technology, the total power density of electronic components is growing, while the physical size of electronic components and electronic equipment is gradually tending to be small and miniaturized, resulting in rapid accumulation of heat, resulting in the increase of heat flux around the integrated devices. Therefore, high temperature environment will affect the electronic components and devices This requires a more efficient thermal control scheme. Therefore, the heat dissipation of electronic components has become a major focus in the current electronic components and electronic equipment manufacturing.
  • GA100-874AA-A1

    GA100-874AA-A1

    GA100-874AA-A1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S1400AN-4FGG676C

    XC3S1400AN-4FGG676C

    XC3S1400AN-4FGG676C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCKU060-2FFVA1156E

    XCKU060-2FFVA1156E

    ​XCKU060-2FFVA1156E Field Programmable Gate Array (FPGA) has the highest signal processing bandwidth among mid-range next-generation transceivers.
  • 370HR PCB

    370HR PCB

    370HR PCB is a kind of high-speed material developed by Isola company of America. It uses FR4 and hydrocarbon perfectly, with stable performance, low dielectric, low loss and easy processing

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