XCZU7EV-2FBVB900I is an SoC (System on Chip) from Xilinx's Zynq UltraScale+ MPSoC (Multi-Processor System on Chip) series. This chip features a heterogeneous processing architecture combining programmable logic and processing units of ARMv8 64-bit processors, providing a high level of performance and flexibility to developers.
XCZU7EV-2FBVB900I is an SoC (System on Chip) from Xilinx's Zynq UltraScale+ MPSoC (Multi-Processor System on Chip) series. This chip features a heterogeneous processing architecture combining programmable logic and processing units of ARMv8 64-bit processors, providing a high level of performance and flexibility to developers.
The XCZU7EV-2FBVB900I chip utilizes a 16nm FinFET process technology and features dual-core ARM Cortex-A53 processors and dual-core Cortex-R5 real-time processors. It also has 256,000 logic cells, 10,578Kb of block RAM, 504 Kb of UltraRAM, and 2,640 DSP slices, which provides plenty of programmable logic resources for accelerating various computational tasks.
Additionally, the XCZU7EV-2FBVB900I chip is designed for high-speed interfaces and can support up to four PCI Express Gen3 or two PCI Express Gen4 lanes, 10 Gigabit Ethernet, and 100 Gigabit Ethernet. It also includes integrated transceivers that support up to 32.75 Gbps for high-speed serial communication.
The "2FBVB900I" in the name of XCZU7EV-2FBVB900I refers to the version of the chip, specifically its speed, temperature, and grade characteristics. The "I" at the end of the name indicates that it is an industrial-grade chip, suitable for use in rugged, harsh environments.
Overall, the XCZU7EV-2FBVB900I SoC is a powerful and flexible chip that can be used in various applications, including embedded vision, Internet of Things (IoT), wireless communication, and advanced instrumentation. It combines both programmable logic and processing units to provide flexible and customizable solutions to accelerate applications with demanding performance requirements.
