XCVU13P-L2FHGA2104E Manufacturers

We know that we only thrive if we can guarantee our combined price competiveness and quality advantageous at the same time for XCVU13P-L2FHGA2104E, We will endeavor to maintain our great reputation as the best products supplier in the world. If you have any questions or comments, please contact with us freely.
XCVU13P-L2FHGA2104E, Our company promises: reasonable prices, short production time and satisfactory after-sales service, we also welcome you to visit our factory at any time you want. Wish we've got a pleasant and long terms business together!!!

Hot Products

  • EPM1270T144I5N

    EPM1270T144I5N

    EPM1270T144I5N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7S15-2FTGB196C

    XC7S15-2FTGB196C

    XC7S15-2FTGB196C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX690T-2FFG1761C

    XC7VX690T-2FFG1761C

    XC7VX690T-2FFG1761C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC2S300E-6FG456C

    XC2S300E-6FG456C

    XC2S300E-6FG456C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10AX115N2F40E2LG

    10AX115N2F40E2LG

    10AX115N2F40E2LG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Multilayer Ceramic PCB

    Multilayer Ceramic PCB

    Multilayer Ceramic PCB substrate refers to a special process board where copper foil is directly bonded to the surface (single side or double side) of alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperature. The following is about Multilayer Ceramic Circuit Board related, I hope to help you better understand Multilayer Ceramic Circuit Board PCB.

Send Inquiry