XCVU125-2FLVB1760I Manufacturers

Gold finger PCB In the extensive use of PCI cable socket gold fingers, gold fingers have been divided into: long and short gold fingers, broken gold fingers, split gold fingers, and gold finger boards. In the process of processing, gold-plated wires need to be pulled. Comparison of conventional gold finger processing processes Simple, long and short gold fingers, the need to strictly control the lead of the gold fingers, requires a second etching to complete.The following is about Gold finger Board related, I hope to help you better understand Gold finger Board.

XC3S400-5FT256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

XCVU9P-2FLGA2104E is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 2.5 million logic cells, 29.5 Mb of block RAM, and 3240 Digital Signal Processing (DSP) slices, making it ideal for high-performance applications such as high-speed networking, wireless communication, and video processing. It operates on a 0.85V to 0.9V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCI Express. The device has a maximum operating frequency of up to 1.2 GHz. The device comes in a flip-chip BGA (FLGA2104E) package with 2104 pins, providing high pin-count connectivity for a variety of applications. XCVU9P-2FLGA2104E is commonly used in advanced systems such as data center acceleration, machine learning, and high-performance computing. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it a top choice for mission-critical applications where reliability and performance are critical.

​XCKU15P-3FFVE1517E Kintex® UltraScale+ ™ FPGA provides high cost-effectiveness in FinFET nodes, offering an economical and efficient solution for applications that require high-end functionality, including 33Gb/s transceivers and 100G connectivity cores.

XCKU095-1FFVA1156I Kintex® UltraScale ™ Field programmable gate arrays can achieve extremely high signal processing bandwidth in mid-range devices and next-generation transceivers

​MT46H16M32LFB5-5IT:C is a type of synchronous dynamic random-access memory (SDRAM) module manufactured by Micron Technology. It has a capacity of 512 megabytes and operates at a frequency of 400 megahertz.