XCVU125-2FLVB1760I Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

XC7K325T-2FFG676I
The XC7K325T-2FFG676I field programmable gate array, after optimization, has the best cost-effectiveness, which is twice as high as the previous generation product, realizing a new type of FPGA.
BCM65800IFBGH
BCM65800IFBGH is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
GA100-895GG1-A1
GA100-895GG1-A1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
XC7Z020-2CLG484I
The XC7Z020-2CLG484I embedded system on chip (SoC) adopts a dual core ARM Cortex-A9 processor configuration, integrating 7 series programmable logic (up to 6.6M logic units and 12.5Gb/s transceiver), providing highly differentiated design for various embedded applications.
XCVU57P-3FSVK2892E
XCVU57P-3FSVK2892E is an FPGA field programmable gate array produced by Xilinx and packaged in BGA-2892. This FPGA has high programmability, allowing users to configure and optimize according to specific application requirements. It is suitable for complex application scenarios that require high-performance computing
BCM56846A1KFTBLG
BCM56846A1KFTBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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Reviews

Distinguishing method of PCB single-layer board and multi-layer board
According to the number of layers, single-sided, double-sided and multilayer circuit boards are divided according to the circuit layer inside.
The Function and Principle of Chips
The main function of a chip is to complete calculations and processing tasks, and an integrated circuit is to package a circuit onto a small component.
When designing a four-layer PCB circuit board, how is the stack-up generally designed?
When designing a four-layer PCB circuit board, how is the stack-up generally designed?
Characteristics of semiconductors
Semiconductor has the following characteristics: dopability, thermal sensitivity, photosensitivity, negative resistivity temperature, and rectifiability.
Difference between missing printing covering layer and laminated covering film of FPC circuit board
After the covering film of FPC circuit board is positioned, it is necessary to heat and pressurize to make the adhesive completely solidified and integrated with the circuit.
Hong Hai OEM production line blessing Sharp may return to the Japanese PC market
Hong Hai cooperates with Sharp, and the outside world is most concerned about in the field of display panels, but the level of cooperation between the two parties is not only this.

XCVU125-2FLVB1760I Manufacturers

Related Products

Hot Products

XC7K325T-2FFG676I

BCM65800IFBGH

GA100-895GG1-A1

XC7Z020-2CLG484I

XCVU57P-3FSVK2892E

BCM56846A1KFTBLG

Distinguishing method of PCB single-layer board and multi-layer board

The Function and Principle of Chips

When designing a four-layer PCB circuit board, how is the stack-up generally designed?

Characteristics of semiconductors

Difference between missing printing covering layer and laminated covering film of FPC circuit board

Hong Hai OEM production line blessing Sharp may return to the Japanese PC market

Kelly 2021-05-19 09:04:42

Klemen Hrovat 2024-01-02 03:00:19

Beryl 2022-09-13 16:02:24

Ann 2022-10-09 21:41:39

Barbara 2024-01-11 18:12:47

Laurel 2023-12-19 16:36:52

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An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.