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The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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  • EP4SGX180FF35I4N

    EP4SGX180FF35I4N

    EP4SGX180FF35I4N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7S25-1CSGA324I

    XC7S25-1CSGA324I

    XC7S25-1CSGA324I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10CL016YF484I7G

    10CL016YF484I7G

    ​10CL016YF484I7G Intel 10CL016YF484I7G Cyclone ® The 10 LP FPGA has been optimized for low cost and low static power consumption, making it an ideal choice for large-scale and cost sensitive applications. The Intel Cyclone 10 LP device provides high-density programmable gates, onboard resources, and general-purpose I/O. These resources can meet the requirements of I/O expansion and chip to chip interface
  • XA6SLX25-3FTG256Q

    XA6SLX25-3FTG256Q

    XA6SLX25-3FTG256Q is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • HI-3210PQI

    HI-3210PQI

    HI-3210PQI is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCV100E-6FG256C

    XCV100E-6FG256C

    XCV100E-6FG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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