Products
Home > Products > XC7K325T-1FBG900C

XC7K325T-1FBG900C Manufacturers

Our solutions are broadly acknowledged and dependable by users and may meet consistently developing economic and social requires for XC7K325T-1FBG900C, Thanks for taking your useful time to go to us and look ahead to have a nice cooperation with you.
XC7K325T-1FBG900C, In order to meet more market demands and long-term development, a 150, 000-square-meter new factory is under construction, which will be put into use in 2014. Then, we shall own a large capacity of producing. Of course, we are going to continue improving the service system to meet the requirements of customers, bringing health, happiness and beauty to everyone.

Related Products

Hot Products

  • XC7VX485T-1FFG1761I

    XC7VX485T-1FFG1761I

    XC7VX485T-1FFG1761I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU2CG-1SFVC784I

    XCZU2CG-1SFVC784I

    XCZU2CG-1SFVC784I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S50A-4TQG144C

    XC3S50A-4TQG144C

    XC3S50A-4TQG144C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM89887A1AFBG

    BCM89887A1AFBG

    BCM89887A1AFBG is typically packaged in a BGA (Ball Grid Array) or similar high-density packaging format. The chip is available through authorized distributors and resellers worldwide. Lead times and pricing may vary depending on market conditions and supplier agreements.
  • XC7VX485T-2FFG1761I

    XC7VX485T-2FFG1761I

    XC7VX485T-2FFG1761I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7Z045-2FBG676I

    XC7Z045-2FBG676I

    XC7Z045-2FBG676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Related Blog
  • Reviews

  • PCB factory Jianding is aggressively attacking the automotive board market and plans to spend 3 billion yuan to expand the capacity of the Hubei Xiantao plant

    PCB factory Jianding Technology is aggressively attacking the automotive board field. On the 21st, the company's board of directors approved a capital increase of 100 million US dollars (about NTD 3 billion) in China's Hubei Xiantao Plant. Demand, the monthly production capacity of 400,000 square feet is expected to be launched in the second quarter.

  • The origin of 50 ohms in impedance matching

    For traces with a certain width, three main factors will affect the impedance of PCB traces. First of all, the EMI (electromagnetic interference) of the near field of the PCB trace is proportional to the height of the trace from the reference plane. The lower the height, the smaller the radiation. Secondly, the crosstalk will change significantly with the height of the trace. If the height is reduced by half, the crosstalk will be reduced to nearly a quarter.

  • Multilayer PCB laminated structure

    Before designing multi-layer PCB, the designer needs to first determine the circuit board structure according to the scale of the circuit

  • High Frequency Printed Circuit Board

    Nowadays, high frequency electronics are of great concern, especially in remote systems. With the rapid development of satellite communication, data items are developing towards fast and high frequency.

  • What are the characteristics of PCB patches from PCB manufacturers

    PCB patch is a popular component connection equipment at present. It has the advantages of excellent performance, corrosion resistance, long service life and so on. Generally, under the condition of no external force damage, the service life of PCB patch can reach more than five years. The overall service life of some PCBs will be even longer. If scientific protection is carried out in the later stage, the failure rate will be greatly reduced. What are the characteristics of PCB patches of PCB manufacturers?

  • Aren't chips and semiconductors the same thing?

    Beginners may be confused by the terms "chip" and "semiconductor" and cannot distinguish their relationship. Today, Hongtai Express Electronics will focus on sorting out the connections and differences between chips and semiconductors that we often talk about.

Send Inquiry