XC7A50T-3FGG484E Manufacturers

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Hot Products

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    BCM75635RPKFBA03G

    BCM75635RPKFBA03G is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Buried Copper Coin PCB

    Buried Copper Coin PCB

    The so-called Buried Copper Coin PCB is a PCB board in which a copper Coin is partially embedded on the PCB. The heating elements are directly attached to the surface of the copper Coin board, and the heat is transferred out through the copper Coin.
  • MT53E1G32D2FW-046WT:B

    MT53E1G32D2FW-046WT:B

    MT53E1G32D2FW-046WT:B is a type of DDR4 SDRAM module. It has a total capacity of 8GB and uses a 288-pin form factor. This module operates at a speed of 2400MHz and has a CAS latency of 17 clock cycles
  • XA6SLX9-2FTG256Q

    XA6SLX9-2FTG256Q

    XA6SLX9-2FTG256Q is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7Z045-2FFG900I

    XC7Z045-2FFG900I

    ​The Xilinx XC7Z045-2FFG900I Zynq ® -7000 SoC first generation architecture is a flexible platform that provides a fully programmable alternative to traditional ASIC and SoC users while launching new solutions. ARM® Cortex ™-
  • XC2S300E-7FGG456C

    XC2S300E-7FGG456C

    ​XC2S300E-7FGG456C is a product in the Spartan IIE FPGA series produced by Xilinx. It belongs to Field Programmable Gate Arrays (FPGAs), which have high flexibility and configurability, and are suitable for various digital circuit designs. The specific specifications and functions of XC2S300E-7FGG456C may include but are not limited to the following:

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