XC7A50T-3FGG484E Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • EP4SGX530KH40I4

    EP4SGX530KH40I4

    ​EP4SGX530KH40I4G - Stratix IV GX High Density and High Performance Field Programmable Gate Array
  • S29GL01GS11TFIV20

    S29GL01GS11TFIV20

    Cypress memory chip, S29GL01GS11TFIV20, stock supply, price advantage, complete models, original quality assurance. Focus on electronic components spot distribution, BOM matching, large-scale stock supply, authentic guarantee!
  • XA7Z020-1CLG400I

    XA7Z020-1CLG400I

    XA7Z020-1CLG400I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX45T-3FGG484C

    XC6SLX45T-3FGG484C

    XC6SLX45T-3FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Half-hole HDI PCB

    Half-hole HDI PCB

    Half-hole HDI PCB is a compact product designed for small capacity users. It adopts modular parallel design, with a module capacity of 1000VA (height of 1U), natural cooling, and can be directly put into a 19 "rack, with a maximum of 6 modules in parallel. The product adopts full digital signal processing (DSP) technology and a number of patent technologies. It has a full range of load adaptability and strong short-term overload capacity, and can not consider the load power factor and peak factor.
  • Multilayer PCB circuit board

    Multilayer PCB circuit board

    Multilayer PCB circuit board--The manufacturing method of multilayer board is generally made by the inner layer pattern first, and then the single or double-sided substrate is made by printing and etching method, which is included in the designated interlayer, and then heated, pressurized and bonded. As for the subsequent drilling, it is the same as the plating through-hole method of double-sided plate. It was invented in 1961.

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