XC7A12T-2CPG238C Manufacturers

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Hot Products

  • XCZU7EV-2FBVB900I

    XCZU7EV-2FBVB900I

    XCZU7EV-2FBVB900I is an SoC (System on Chip) from Xilinx's Zynq UltraScale+ MPSoC (Multi-Processor System on Chip) series. This chip features a heterogeneous processing architecture combining programmable logic and processing units of ARMv8 64-bit processors, providing a high level of performance and flexibility to developers.
  • 200G optical module PCB

    200G optical module PCB

    The 200G optical module PCB is composed of shell, PCBA (PCB blank board + driver chip) and optical devices (dual fiber: Tosa, Rosa; single fiber: Bosa). In short, the function of the optical module is photoelectric conversion. The transmitter converts the electrical signal into the optical signal, and then the receiver converts the optical signal into the electrical signal after transmission through the optical fiber.
  • XC6VLX130T-2FFG1156C

    XC6VLX130T-2FFG1156C

    XC6VLX130T-2FFG1156C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • EPF6016QC208-2N

    EPF6016QC208-2N

    EPF6016QC208-2N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • BCM68461A1KRFBG

    BCM68461A1KRFBG

    BCM68461A1KRFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7A75T-3FGG676E

    XC7A75T-3FGG676E

    ​XC7A75T-3FGG676E is an FPGA (Field Programmable Gate Array) chip produced by XILINX company. Here is a detailed introduction to the chip:

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